Program

IMPACT 2024 Program 

Please be noted that IMPACT committee reserves the right for modification.
For any inquriy, please contact IMPACT Secretariat via email(service@impact.org.tw) or phone(+886-3-3815659#407)

Professional Development CoursePlenary SpeechIndustrial / Special sessionPackaging session (Oral)PCB session (Oral)Interactive session (Poster)
TimeTUE October 22TimeWED October 23TimeTHUR October 24TimeFRI October 25
　　　701 EF, TaiNEX 2　Room 504　R504 aR504 bR504 cR503R502
10:00-10:20Grand Opening & Award Ceremony9:00-9:50<Plenary Speech III>
Ki-ill Moon, VP, SK Hynix		8:20-10:20【S22】【S23】【S24】【S25】【S26】
ISMPGlass substrateInterconnections & NanotechnologyHDI, IC Substrate and FPC Technology-2Advanced Materials, Automatic Process & Assembly
10:20-11:10

<Plenary Speech I>
Hidehiro Tsukano, Senior Vice President

NTT

9:50-10:40<Plenary Speech IV>
Glenn Daves, SVP, NXP
11:10-12:00<Plenary Speech II>
Dr. C.S. Yoo, VP, TSMC		10:40-12:10【S11】10:30-12:30【S27】【S28】【S29】【S30】【S31】
Heterogeneous IntegrationAdvanced Packaging Technologies-4Design, Modeling, AI/Machine Learning Applications, and Testing / Smart manufacturingAdvanced and Green Materials and Process-2Test, Quality, Inspection and Reliability / Smatt Manufacturing
IEEE EPS Panel - Heterogeneous Integration Roadmap Compact Session(ASE)
　　12:00-13:30Lunch12:00-13:30Lunch12:30-13:30Lunch
13:00-14:00R504a13:30-15:30R504aR504bR504cR503R50213:30-15:30R504 aR504 bR504 cR503R50213:30-15:30R504 aR504 bR504 c　
【Free Lecture】【S1】【S2】【S3】【S4】【S5】【S12】【S13】【S14】【S15】【S16】【S32】【S33】【S34】　
IEEE-EPS Distinguish Lecture on Advanced Substrates by Dr. John LauIntel - Ecosystem Enabling for Intel Data Center AI Server SolutionsMKS’ Atotech - Advancing AI chips from silicon to PCBAdvanced Packaging Technologies-1Design, Modeling, AI/Machine Learning Applications, and Testing -1Sustainable Technologies & SystemsDupont - Shaping Our Future with AI by Next-Gen Substrate and PackagingMarket trend-Innovative 3D IC Heterogeneous Integration PackagingICEPAdvanced Packaging Technologies-3Design, Modeling, AI/Machine Learning Applications, and Testing -23D embedding technology toward heterogeneous integrationDesign, Modeling, Al/Machine Learning Applications, and Testing /Advanced ProcessInterconnections & Nanotechnology & Advanced Materials, Automatic Process & Assembly　
14:00-14:30Break
14:30-17:40R504aR504b
【PDC1】【PDC2】15:00-16:00Interacitve session I15:00-16:00Interacitve session II　
Dr. John LauDr. Ning Cheng Lee

16:00-18:00

【S6】【S7】【S8】【S9】【S10】16:00-18:00【S17】【S18】【S19】【S20】【S21】
AMD - Server Solution Customer SI+EV EnablementJIEP- Topics for advanced packaging processes in JapanAdvanced Packaging Technologies-2HDI, IC Substrate and FPC Technology-1Power Electronics Packaging-1SPIL-Advanced PackagingSMTAPower Electronics Packaging-2Advanced and Green Materials and Process-1Test, Quality, Inspection and Reliability / Simulation


Organizer
Co-Organizer
 
       
Partner
           
Co-hosting Event - TPCA Show 2025

Opening Venue：7F Taipei Nangang Exhibition Center (Hall 2)