Program

IMPACT 2023 Program 

Please be noted that IMPACT committee reserves the right for modification.
For any inquriy, please contact IMPACT Secretariat via email(service@impact.org.tw) or phone(+886-3-3815659#406)

IMPACT Conference 2023 program

Plenary SpeechIndustrial / Special SessionPackaging SessionPCB SessionPoster Session
TimeWednesday October 25TimeThursday October 26TimeFriday October 27
 Room 504abc Room 504ab Room 504a
10:00-10:20Joint Opening & Award Ceremony09:00-10:30

IEEE EPS and CEDA Joint Panel_ Co-Design for AI 

(ASE Grouup)

09:00-09:40<Plenary Speech III>
10:20-11:10<Plenary Speech I>Dr. Beth Keser, VP, Zero ASIC
Dr. Jun He, VP, TSMC09:40-10:20<Plenary Speech IV>
Dr. Takayuki Ohba, Professor,
Tokyo Institute of Technology
11:10-12:00<Plenary Speech II>10:40-12:30R504 aR504 bR504 cR50310:30-12:30R504 aR504 bR504 cR503
Dr. Raja Swaminathan,CVP, AMD【S9】【S10】【S11】【S12】【S21】【S22】【S23】【S24】
JIEPLeading Advanced Packaging (SPIL)Advanced Materials, Automatic Process & BondingAdvanced Interconnection & ReliabilityMarket Trend： Innovative Packaging Technology Applied in AR/VR, AI, and ESGThermal Modeling & CharacterizationHigh Speed Signal & InterconnectAdvanced PCB/Substrate & Soldering 
12:00-13:30Lunch12:30-13:30Lunch12:30-13:30Lunch
13:30-15:30R504aR504bR504cR50313:30-15:30R504 aR504 bR504 cR50313:30-16:00R504 aR504 bR504 cR503
【S1】【S2】【S3】【S4】【S13】【S14】【S15】【S16】【S25】【S26】【S27】【S28】
iNEMIAI Creating a New ERA of Advanced packaging (MKS' Atotech)Fan-out Packaging & InterconnectionPower ElectronicsICEPIntel Data Center Modular Hardware System (Intel)Advanced Packaging Material Modeling & CharacterizationAdvanced and Green Materials & ProcessJIEPDesign, Modeling & TestingAdvanced Packaging & Material CaracterizationHDI & FPC Technologies
15:30-15:50Poster session (Packaging)15:30-15:50Poster session (PCB) 
15:50-17:50【S5】【S6】【S7】【S8】15:50-17:50【S17】【S18】【S19】【S20】
3D EmbeddingIAAC :Technology for Chiplets Interface (iMAPS Taiwan)Advanced Packaging & ProcessingPower ElectronicsHeterogeneous
Integration		AI-based Reliability Characterization & PredictionAdvanced Packaging TechnologiesTest, Inspection & Characterization
18:15-
20:30		IMPACT 2023 Welcome Dinner (by Invited) 


Organizer
Co-Organizer
        
Media Partner
       
Co-hosting Event - TPCA Show 2024
pcea.net