IMPACT 2022

IMPACT 2022 Tentative Program (updated on Aug. 19th,2022)

Please be noted that IMPACT committee reserves the right for modification.
For any inquriy, please contact IMPACT Secretariat via email(service@impact.org.tw) or phone(+886-3-3815659#406)

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Plenary

Industrial

Special

Packaging

PCB

Poster

Time

Wednesday October 26

Time

Thursday October 27

Time

Friday October 28

Room 504

10:00-10:20

IMPACT 2022 Opening & Awards Ceremony

09:00-09:40

<Plenary Speech III>
Yee Wei Huang

Spokesperson and Vice President, Realtek

08:50-09:30

Plenary Speech IV

Hidenori Abe,

Director, Showa Denko Materials

10:20-11:10

<Plenary Speech I>
Kam Heng Lee

Senior Director, TSMC

9:30-10:10

Plenary Speech V

Shiuh Kao Chiang

Managing Partner, Prismark

11:10-12:00

<Plenary Speech II>
ST Liew
Vice President, Qualcomm Technologies Inc. President, Qualcomm Taiwan, SEA, ANZ

10:00-12:00

R504 a

R504 b

R504 c

R503

10:30-12:30

R504 a

R504 b

R504 c

R503

【S9】

【S10】

【S11】

【S12】

【S21】

【S22】

【S23】

【S24】

IEEE- EPS Panel

Technological Innovation by Nan Ya Plastics

rGo metallization process and its applications on 5G PCB by
TRIALLIAN

Advanced Bonding and Interconnect Technology

Market trend:Innovative More-than-Moore Packaging

Power Electronics

Advanced Packaging Ⅱ

HDI, IC Substrate and FPC Technology

12:00-13:10

Lunch

12:10-13:10

Lunch

12:30-13:30

Lunch

13:10-15:10

R504 a

R504 b

R504 c

R503

13:10-15:10

R504 a

R504 b

R504 c

R503

13:30-15:30

R504 a

R504 b

R504 c

【S1】

【S2】

【S3】

【S4】

【S13】

【S14】

【S15】

【S16】

【S25】

【S26】

【S27】

Packaging Innovations by
SPIL

High Speed PCB for edge computing applications by Atotech

JIEP

Advanced Packaging Ⅰ

ICEP

Intel Modular Data Center Platform Design Architecture

Fan-Out and Heterogeneous Packaging

Advanced and Green Materials and Process

Advacned Design & Emerging Modeling

Advanced Packagng Process and Design

Advanced Substrate/PCB Process and Manufacturing

15:10-15:40

Poster session (Packaging)

15:10-15:40

Poster session (PCB)

15:40-17:40

【S5】

【S6】

【S7】

【S8】

15:40-17:40

【S17】

【S18】

【S19】

【S20】

High Density Fan-out Packaging Solution for Chiplets by ASE

Advanced packaging for data center/ server applications by Atotech

3D Embedding

Advanced Design, Modeling & Testing I

Heterogeneous
Integration

Advanced Design, Modeling & Testing II

Advanced Materials, Automatic Process & Assembly

Test, Quality, Inspection and Reliability

18:00-20:00

IMPACT 2022 Welcome Dinner
(by Invited)