IMPACT 2022 Tentative Program (updated on Aug. 19th,2022)

Oral Session      Poster Session

Please be noted that IMPACT committee reserves the right for modification.
For any inquriy, please contact IMPACT Secretariat via email(service@impact.org.tw) or phone(+886-3-3815659#406)

 

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PlenaryIndustrialSpecialPackagingPCBPoster
TimeWednesday October 26TimeThursday October 27TimeFriday October 28
 Room 504abc Room 504ab Room 504a
10:00-10:20Joint Opening & Award Ceremony09:00-09:40<Plenary Speech III>
Yee-Wei Huang, VP, Realtek
08:50-09:30

Plenary Speech IV

Hidenori Abe, Director, Showa Denko Materials

10:20-11:10<Plenary Speech I>
Kamheng Lee,Senior Director,TSMC
9:30-10:10

Plenary Speech V

Shiuh-Kao Chiang, Managing Partner, Prismark

11:10-12:00<Plenary Speech II>
ST Liew
President of Qualcomm Taiwan
10:00-12:00R504 aR504 bR504 cR50310:30-12:30

 
R504 aR504 bR504 cR503
【S9】【S10】【S11】【S12】【S21】【S22】【S23】【S24】
IEEE- EPS PanelTechnological Innovation by Nan Ya PlasticsrGo metallization process and its applications on 5G PCB by
TRILLIAN

Advanced Bonding and Interconnect Technology
Market trend:Innovative More-than-Moore Packaging
Power Electronics

Advanced Packaging Ⅱ
HDI, IC Substrate and FPC Technology
12:00-13:10Lunch12:10-13:10Lunch12:30-13:30Lunch
13:10-15:10R504 aR504 bR504 cR50313:10-15:10R504 aR504 bR504 cR50313:30-15:30R504 aR504 bR504 c
【S1】【S2】【S3】【S4】【S13】【S14】【S15】【S16】【S25】【S26】【S27】
Packaging Innovations by
SPIL
High Speed PCB for edge computing applications by AtotechJIEP

Advanced Packaging Ⅰ
ICEP
Intel Modular Data Center Platform Design Architecture
Fan-Out and Heterogeneous Packaging
Advanced and Green Materials and ProcessAdvacned Design & Emerging ModelingAdvanced Packagng Process and Design

Advanced Substrate/PCB Process and Manufacturing

15:10-15:40Poster session (Packaging)15:10-15:40Poster session (PCB)
15:40-17:40【S5】【S6】【S7】【S8】15:40-17:40【S17】【S18】【S19】【S20】
High Density Fan-out Packaging Solution for Chiplets by ASEAdvanced packaging for data center/ server applications by Atotech3D EmbeddingAdvanced Design, Modeling & Testing IHeterogeneous
Integration
Advanced Design, Modeling & Testing IIAdvanced Materials, Automatic Process & AssemblyTest, Quality, Inspection and Reliability
18:00-20:00IMPACT 2022 Welcome Dinner
(Invited only)

Organizer
Co-Organizer
        
Media Partner
Co-hosting Event - TPCA Show 2022