IMPACT 2023 Program 

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IMPACT Conference 2023 program

Plenary SpeechIndustrial / Special SessionPackaging SessionPCB SessionPoster Session
TimeWednesday October 25TimeThursday October 26TimeFriday October 27
 Room 504abc Room 504ab Room 504a
10:00-10:20Joint Opening & Award Ceremony09:00-10:30

IEEE EPS and CEDA Joint Panel_ Co-Design for AI 

(ASE Grouup)

09:00-09:40<Plenary Speech III>
10:20-11:10<Plenary Speech I>Dr. Beth Keser, VP, Zero ASIC
Dr. Jun He, VP, TSMC09:40-10:20<Plenary Speech IV>
Dr. Takayuki Ohba, Professor,
Tokyo Institute of Technology
11:10-12:00<Plenary Speech II>10:40-12:30R504 aR504 bR504 cR50310:30-12:30R504 aR504 bR504 cR503
Dr. Raja Swaminathan,CVP, AMD【S9】【S10】【S11】【S12】【S21】【S22】【S23】【S24】
JIEPLeading Advanced Packaging (SPIL)Advanced Materials, Automatic Process & BondingAdvanced Interconnection & ReliabilityMarket Trend: Innovative Packaging Technology Applied in AR/VR, AI, and ESGThermal Modeling & CharacterizationHigh Speed Signal & InterconnectAdvanced PCB/Substrate & Soldering 
13:30-15:30R504aR504bR504cR50313:30-15:30R504 aR504 bR504 cR50313:30-16:00R504 aR504 bR504 cR503
iNEMIAI Creating a New ERA of Advanced packaging (MKS' Atotech)Fan-out Packaging & InterconnectionPower ElectronicsICEPIntel Data Center Modular Hardware System (Intel)Advanced Packaging Material Modeling & CharacterizationAdvanced and Green Materials & ProcessJIEPDesign, Modeling & TestingAdvanced Packaging & Material CaracterizationHDI & FPC Technologies
15:30-15:50Poster session (Packaging)15:30-15:50Poster session (PCB) 
3D EmbeddingIAAC :Technology for Chiplets Interface (iMAPS Taiwan)Advanced Packaging & ProcessingPower ElectronicsHeterogeneous
AI-based Reliability Characterization & PredictionAdvanced Packaging TechnologiesTest, Inspection & Characterization
IMPACT 2023 Welcome Dinner (by Invited) 

Media Partner
Co-hosting Event - TPCA Show 2024