P1. Advanced Packaging Technologies
Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/Fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Other new technologies for advanced microelectronics.
P2. Power Electronics Packaging
GaN power device, SiC power MOSFET, High voltage packages, IGBT module assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) Bonding, Advanced cooling system, Ceramic substrate technologies (DBC, DPC, AMB..etc), High-performance passive components, High speed/integration power package.
P3. Heterogeneous Integration
SiP (PoP, PiP), 3D integration including TSV, wafer thinning, wafer alignment, wafer bonding, wafer dicing, unerfill, interposer, and 3D IC applications, etc.
P4. Wearable Technologies
Flexible electronics packaging, Advanced FPC technology, ACF/ACP bonding, Thin packaging, Low-temperature bonding, MEMS sensor packages, Any advanced packaging related to IoT (Internet of Things), etc.
P5. Interconnections & Nanotechnology
Interconnect technologies on all packaging levels including wire bonding, flip chip, and TSV. Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP), under bump metallurgy, electromigration, micro-bump, substrate technology, novel enabling techniques, electrical performance, and environmental concerns.
P6. Modeling, Simulation & Design
Electrical, optical, and mechanical modeling, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, Advanced numerical and analytical simulation methodologies and tools, Design rule development, Virtual prototyping in product and/or process design, From micro to macro simulation, Multi-physics simulation.
P7. Thermal Management
Package level, PCB level and system level thermal solutions of advanced HPC system, server, portable system, 5G communication, bio-medical, IOT, EV and other advanced applications, Advanced thermal material, components and testing including thermal conductivity TIM materials, heat spreader, heat sink, heat pipe, vapor chamber, thermoelectric device, cold plate, immersion cooling and other advanced thermal solutions.
P8. Advanced Sensor & Microsystems Technology (MST)
Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, Sensing, actuation and control circuits on microsystems.
P9. Advanced Materials, Automatic Process & Assembly
Materials and automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes and equipment for automation.
P10. Emerging Systems Packaging Technologies
Renewable energy, Energy storage, Embedded passives & actives on substrates, Packaging solutions for RF-microwave, flexible electronics, bioelectronics, automotive electronics, optoelectronics and medical Electronics, Other novel system packaging technologies, Green packaging, LED and optoelectronics packaging.