IMPACT 2021 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on Oct. 20th -22nd at Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2021. For grasping the latest trend, the symposium this year highlights the theme “IMPACT on 5G+”. As the rapid growth of 5G coverage over the world, the 5G commercial network enables an array of revolutionary technologies such as loT, artificial intelligence (AI), edge computing and wearable devices. Given the foundational infrastructure is advancing along with technologies, 5G brings faster speed and connectivity to those using it.
      IMPACT 2021 looks at the cutting-edge technological applications. With the increasing amount of data collected and leverage machine learning and artificial intelligence, may achieve a breakthrough in terms of high security and privacy-preservation, and increased efficiency.
      IMPACT 2021 will arrange plenary speeches, special sessions, industrial sessions, invited talks, and outstanding paper and poster presentations. Meanwhile, this conference keeps collaborating with international organizations such as ICEP、JIEP from Japan, KAIST from South Korea, and iNEMI from USA in this year’s gathering.


*Scope covers from PACKAGING TO PCB, papers relevant with below scopes are encouraged to submit but NOT limted to.


P1. Advanced Packaging Technologies

Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/Fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Other new technologies for advanced microelectronics.

P2. Power Electronics Packaging

GaN power device, SiC power MOSFET, High voltage packages, IGBT module assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) Bonding, Advanced cooling system, Ceramic substrate technologies (DBC, DPC, AMB..etc), High-performance passive components, High speed/integration power package.

P3. Heterogeneous Integration

SiP (PoP, PiP), 3D integration including TSV, wafer thinning, wafer alignment, wafer bonding, wafer dicing, unerfill, interposer, and 3D IC applications, etc.

P4. Wearable Technologies

Flexible electronics packaging, Advanced FPC technology, ACF/ACP bonding, Thin packaging, Low-temperature bonding, MEMS sensor packages, Any advanced packaging related to IoT (Internet of Things), etc.

P5. Interconnections & Nanotechnology

Interconnect technologies on all packaging levels including wire bonding, flip chip, and TSV. Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP), under bump metallurgy, electromigration, micro-bump, substrate technology, novel enabling techniques, electrical performance, and environmental concerns. 

P6. Modeling, Simulation & Design

Electrical, optical, and mechanical modeling, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, Advanced numerical and analytical simulation methodologies and tools, Design rule development, Virtual prototyping in product and/or process design, From micro to macro simulation, Multi-physics simulation.

P7. Thermal Management

Package level, PCB level and system level thermal solutions of advanced HPC system, server, portable system, 5G communication, bio-medical, IOT, EV and other advanced applications, Advanced thermal material, components and testing including thermal conductivity TIM materials, heat spreader, heat sink, heat pipe, vapor chamber, thermoelectric device, cold plate, immersion cooling and other advanced thermal solutions.

P8. Advanced Sensor & Microsystems Technology (MST)

Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, Sensing, actuation and control circuits on microsystems.

P9. Advanced Materials, Automatic Process & Assembly

Materials and automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes and equipment for automation.

P10. Emerging Systems Packaging Technologies

Renewable energy, Energy storage, Embedded passives & actives on substrates, Packaging solutions for RF-microwave, flexible electronics, bioelectronics, automotive electronics, optoelectronics and medical Electronics, Other novel system packaging technologies, Green packaging, LED and optoelectronics packaging.


B1. Advanced and Green Materials and Process

Green (LF, HF, energy saving, recycling) material, and green process on board manufacturing (Rigid, Flex, Rigid-Flex, Substrate), Millimeter Wave
Low Dk, Low Df, Low CTE, High frequency application

B2. Test, Quality, AOI, Inspection and Reliability

Visual inspection, Structure integrity, inspection, X-ray, AOI, electrical test, failure analysis.

B3. HDI Technology(Fine and ultra fine line technology for Rigid、Flex、Rigid/Flex and IC substrate)

Lamination for Build-up board, copper plating for Microvia filling and Deep PTH Resin plugging.

B4. Electroplating and Electrochemical Processing Technology

Electro-chemical migration, PTH, Plating and etching chemical and process.

B5. Smart Manufacturing and Automation

Mechatronics, robotics, automation, control systems
Elements, structures, mechanisms, and their applications
Telerobotics, human computer interaction, human-robot interaction
Control system modeling, simulation techniques, and control applications
Intelligent control, neuro-control, fuzzy control and their applications
Industrial process control, manufacturing process and automation (tentative)



June 18th, 2021 

Abstract Submission deadline

July 14th, 2021

Acceptance Notification

August 18th, 2021

Advanced Program online

August 31th, 2021

Full Paper Submission dealine




Co-hosting Event - TPCA Show 2021