IMPACT 2022

PAPER SUBMISSION

　　IMPACT 2022 Conference, which is organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on Oct. 26th -28th at Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2022. For grasping the latest trend, the symposium highlights the theme “IMPACT on Empowered Edge Computing", which will explore the latest advances, challenges, and hot topics relevant to advanced research in the packaging and PCB field.

　　Edge computing is the unique, distributed computing architecture that brings data storage and computation closer to the data source, which helps to reduce bandwidth usage and latency. Therefore, edge tech plays a crucial role in supporting Internet-of-Things (loT), artificial intelligence (AI), autonomous vehicles, smart healthcare and intelligent cities into practice.

　　IMPACT 2022 looks at the future of edge computing and how it will revolutionize the industry. Thus, the organizer will arrange plenary speeches, special sessions, industrial sessions, invited talks, outstanding papers, and poster presentations. Meanwhile, this conference will keep collaborating with international organizations such as ICEP, JIEP from Japan, and iNEMI from the USA in this year's gathering.

SCOPE OF PAPER SOLICITED

*Scope covers from PACKAGING TO PCB, papers relevant to the below scopes are encouraged to submit but NOT limited to.

PACKAGING

P1. Advanced Packaging Technologies

Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/Fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Heterogeneous integration (side-by-side integration, vertical stacking integration, chiplet, high bandwidth memory, high performance computing package, Si interposer, organic interposer, fanout package, Si bridge, advanced substrate, 3DIC, hybrid bonding, TSV, wafer bonding, mobile heterogeneous integration (SiP, PoP, PiP), Other new technologies for advanced microelectronics.

P2. Power Electronics Packaging

Si/GaN/SiC based power device and module (IGBT, MOSFET, HEMT, diode, IPM etc.), Power electronic module systems (inverter, converter, rectifier etc.), Fabrication and assembly. Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) bonding, Advanced cooling system, Ceramic substrate technologies (DBC, IMS, DPC, AMB etc.), High-performance passive components (Super capacitor, inductor etc.), Other related technologies.

P3. Wearable Technologies

Flexible electronics packaging, Advanced FPC technology, ACF/ACP bonding, Thin packaging, Low-temperature bonding, MEMS sensor packages, any advanced packaging related to IoT (Internet of Things), etc.

P4.Interconnections & Nanotechnology

Interconnect technologies on all packaging levels including wire bonding, flip chip and TSV connections, first-level package. Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP), under bump metallurgy, electromigration, micro-bump, substrate technology, novel enabling techniques, electrical performance, environmental concerns.

P5.Design, Modeling, AI/Machine Learning Applications, and Testing

Electrical, optical, thermal and mechanical modeling & design, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, AI/Machine Learning Applications, Design-on-Simulation Technologies and tools, Design rule development, Virtual prototyping in product and/or process design, From micro to macro simulation, Multi-physics simulation, Thermal management (materials, two-phase heat transfer, air cooling/liquid cooling, emerging cooling technology, thermoelectric cooling & generation etc.)

P6. Advanced Sensor &Microsystems Technology (MST)

Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, Sensing, actuation and control circuits on microsystems.

P7. Advanced Materials, Automatic Process & Assembly

Materials and Automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes and Equipment for Automation.

P8. Emerging Systems Packaging Technologies

Renewable Energy, Energy Storage, Embedded passives & actives on substrates, Packaging solutions for RF-Microwave, flexible electronics, bioelectronics, automotive electronics, optoelectronics and Medical Electronics, Other novel system packaging technologies, Green packaging, LED & Optoelectronics packaging.

PCB

B1. Advanced and Green Materials and Process

Green materials(LF、HF、 Energy saving、 Recycling and Reducing) , Green process and manufacturing , Millimeter-wave materials(Low Dk/Df), Low CTE and low water absorption materials, Photo and non-photo dielectric materials for high density application, Advanced Substrate materials and process.

B2.Test, Quality, Inspection and Reliability

Feature Testing and Verification, Inspection(AOI, Non-destructive testing), Electrical evaluation, Structure integrity, Failure mechanism analysis.

B3. HDI, IC Substrate and FPC Technology

SAP and m-SAP process(Fine pitch line), Build-up board, Micro-vias and copper plating process, Multilayer core and coreless , Embedded devices, Advanced flex and rigid-flex, High speed and high frequency circuitry, High power substrate

B4. Smart Manufacturing and Automation

Mechatronics, Robotics, Control systems, Tele-robotics, Human computer(robot) interaction, Modeling and simulation techniques, Intelligent control and manufacturing, Neuro-control, Fuzzy control and their applications, Automatic control system, Process integration

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