P3.Interconnections & Nanotechnology
Interconnect technologies on all packaging levels (wire bonding, flip chip and TSV connections, first-level package etc.), Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP etc.), Under bump metallurgy, Electromigration, Micro-bump, Substrate technology, Novel enabling techniques, Electrical performance, and Environmental concerns.
P4.Design, Modeling, AI/Machine Learning Applications, and Testing
Electrical, optical, thermal and mechanical modeling & design, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, AI/machine learning applications, Design-on-Simulation technologies and tools, Design rule development, Virtual prototyping in product and/ or process design, From micro to macro simulation, Multi-physics simulation, and Thermal management (materials, heat sink, heat pipe, fan, thermal interface material, package-, board- and system level thermal design, measurement technology, two-phase heat transfer, air cooling/liquid cooling,
immersion cooling, emerging cooling technology, thermoelectric cooling & generation etc.)
P5. Advanced Materials, Automatic Process & Assembly
Materials and automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging, including adhesives, encapsulants, lead free solders and alloys, thermal interface materials, high/low-k dielectrics and substrates, thin films, TSV drilling/etching, plating, low temperature bonding, assembly processes, and equipment for automation.
P6. Emerging Systems Packaging Technologies
Embedded passives & actives on substrates, Packaging solutions for RF-microwave, bioelectronics, automotive electronics, photonics, micro-LED, and medical electronics, Green packaging, Renewable energy, Energy storage, Wearable/flexible technologies and Other novel system packaging technologies.
P7. Advanced Sensor & Microsystems Technology (MST)
Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, and Sensing, actuation and control circuits on microsystems.