P1. Advanced Packaging Technologies
Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/Fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Heterogeneous integration (side-by-side integration, vertical stacking integration, chiplet, high bandwidth memory, high performance computing package, Si interposer, organic interposer, fanout package, Si bridge, advanced substrate, 3DIC, hybrid bonding, TSV, wafer bonding, mobile heterogeneous integration (SiP, PoP, PiP), Other new technologies for advanced microelectronics.
P2. Power Electronics Packaging
Si/GaN/SiC based power device and module (IGBT, MOSFET, HEMT, diode, IPM etc.), Power electronic module systems (inverter, converter, rectifier etc.), Fabrication and assembly. Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) bonding, Advanced cooling system, Ceramic substrate technologies (DBC, IMS, DPC, AMB etc.), High-performance passive components (Super capacitor, inductor etc.), Other related technologies.
P3. Wearable Technologies
Flexible electronics packaging, Advanced FPC technology, ACF/ACP bonding, Thin packaging, Low-temperature bonding, MEMS sensor packages, any advanced packaging related to IoT (Internet of Things), etc.
P4.Interconnections & Nanotechnology
Interconnect technologies on all packaging levels including wire bonding, flip chip and TSV connections, first-level package. Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP), under bump metallurgy, electromigration, micro-bump, substrate technology, novel enabling techniques, electrical performance, environmental concerns.
P5.Design, Modeling, AI/Machine Learning Applications, and Testing
Electrical, optical, thermal and mechanical modeling & design, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, AI/Machine Learning Applications, Design-on-Simulation Technologies and tools, Design rule development, Virtual prototyping in product and/or process design, From micro to macro simulation, Multi-physics simulation, Thermal management (materials, two-phase heat transfer, air cooling/liquid cooling, emerging cooling technology, thermoelectric cooling & generation etc.)
P6. Advanced Sensor &Microsystems Technology (MST)
Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, Sensing, actuation and control circuits on microsystems.
P7. Advanced Materials, Automatic Process & Assembly
Materials and Automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes and Equipment for Automation.
P8. Emerging Systems Packaging Technologies
Renewable Energy, Energy Storage, Embedded passives & actives on substrates, Packaging solutions for RF-Microwave, flexible electronics, bioelectronics, automotive electronics, optoelectronics and Medical Electronics, Other novel system packaging technologies, Green packaging, LED & Optoelectronics packaging.