P1. Advanced Packaging Technologies
Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Heterogeneous integration (side-by-side integration, vertical stacking integration, chiplet, high bandwidth memory), High performance computing package, Si interposer, Organic interposer, Fanout package, Si bridge, Advanced substrate, 3DIC, Hybrid bonding, TSV, Wafer bonding, Mobile heterogeneous integration (SiP, PoP, PiP etc.), and Other new technologies for advanced microelectronics. Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, and Sensing, actuation and control circuits on microsystems.
P2. Power Electronics Packaging
Si/GaN/SiC based power device and module (IGBT, MOSFET, HEMT, diode, IPM etc.), Power electronic module systems (inverter, converter, rectifier etc.), Fabrication and assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) bonding, Interconnection (wire-bonding, Cu clip bonding, chip embedded PCB etc.), Encapsulant material, Advanced cooling system, Ceramic substrate technologies (DBC, IMS, DPC, AMB etc.), High-performance passive components (super capacitor, inductor etc.), and Other related technologies.
P3.Interconnections & Nanotechnology
Interconnect technologies on all packaging levels (wire bonding, flip chip and TSV connections, first-level package etc.), Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP etc.), Under bump metallurgy, Electromigration, Micro-bump, Substrate technology, Novel enabling techniques, Electrical performance, and Environmental concerns.
P4.Design, Modeling, AI/Machine Learning Applications, and Testing
Electrical, optical, thermal and mechanical modeling & design, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, AI/machine learning applications, Design-on-Simulation technologies and tools, Design rule development, Virtual prototyping in product and/ or process design, From micro to macro simulation, Multi-physics simulation, and Thermal management (materials, heat sink, heat pipe, fan, thermal interface material, package-, board- and system level thermal design, measurement technology, two-phase heat transfer, air cooling/liquid cooling,
immersion cooling, emerging cooling technology, thermoelectric cooling & generation etc.)
P5. Advanced Materials, Automatic Process & Assembly
Materials and automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging, including adhesives, encapsulants, lead free solders and alloys, thermal interface materials, high/low-k dielectrics and substrates, thin films, TSV drilling/etching, plating, low temperature bonding, assembly processes, and equipment for automation.
P6. Emerging Systems Packaging Technologies
Embedded passives & actives on substrates, Packaging solutions for RF-microwave, bioelectronics, automotive electronics, photonics, micro-LED, and medical electronics, Wearable/flexible technologies and Other novel system packaging technologies.
P7. Sustainable Technologies & Systems
Green and sustainable electronics, Net zero strategy/technology, Green packaging, Renewable energy, Energy storage