IMPACT 2023

PAPER SUBMISSION

　IMPACT 2023 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year's event will be held from Oct. 25th-27th at Taipei Nangang Exhibition Center in conjunction with TPCA Show 2023. The symposium will focus on the theme “IMPACT on the future of HPC, AI, and Metaverse", exploring the latest electronic technologies and fostering collaboration among enterprises and organizations.

The rapid development of HPC, AI, and Metaverse technologies will revolutionize existing technologies, connecting people in new ways and redefining our lives. To provide a valuable platform for these innovations, IMPACT 2023 will host plenary speeches, special sessions, industrial sessions, invited talks, outstanding papers, and poster presentations. This conference also collaborates with international organizations such as ICEP and JIEP from Japan, iNEMI and IEEE EPS from the USA, and global consulting companies like Yole Développement and Techsearch from the USA. Join us at IMPACT 2023 to be part of the future of electronics technology!

SCOPE OF PAPER SOLICITED

*Scope covers from PACKAGING TO PCB; papers relevant to the below scopes are encouraged to submit but NOT limited to.

PACKAGING

P1. Advanced Packaging Technologies

Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Heterogeneous integration (side-by-side integration, vertical stacking integration, chiplet, high bandwidth memory), High performance computing package, Si interposer, Organic interposer, Fanout package, Si bridge, Advanced substrate, 3DIC, Hybrid bonding, TSV, Wafer bonding, Mobile heterogeneous integration (SiP, PoP, PiP etc.), and Other new technologies for advanced microelectronics.

P2. Power Electronics Packaging

Si/GaN/SiC based power device and module (IGBT, MOSFET, HEMT, diode, IPM etc.), Power electronic module systems (inverter, converter, rectifier etc.), Fabrication and assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) bonding, Interconnection (wire-bonding, Cu clip bonding, chip embedded PCB etc.), Encapsulant material, Advanced cooling system, Ceramic substrate technologies (DBC, IMS, DPC, AMB etc.), High-performance passive components (super capacitor, inductor etc.), and Other related technologies.

P3.Interconnections & Nanotechnology

Interconnect technologies on all packaging levels (wire bonding, flip chip and TSV connections, first-level package etc.), Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP etc.), Under bump metallurgy, Electromigration, Micro-bump, Substrate technology, Novel enabling techniques, Electrical performance, and Environmental concerns.

P4.Design, Modeling, AI/Machine Learning Applications, and Testing

Electrical, optical, thermal and mechanical modeling & design, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, AI/machine learning applications, Design-on-Simulation technologies and tools, Design rule development, Virtual prototyping in product and/ or process design, From micro to macro simulation, Multi-physics simulation, and Thermal management (materials, heat sink, heat pipe, fan, thermal interface material, package-, board- and system level thermal design, measurement technology, two-phase heat transfer, air cooling/liquid cooling,
immersion cooling, emerging cooling technology, thermoelectric cooling & generation etc.)

P5. Advanced Materials, Automatic Process & Assembly

Materials and automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging, including adhesives, encapsulants, lead free solders and alloys, thermal interface materials, high/low-k dielectrics and substrates, thin films, TSV drilling/etching, plating, low temperature bonding, assembly processes, and equipment for automation.

P6. Emerging Systems Packaging Technologies

Embedded passives & actives on substrates, Packaging solutions for RF-microwave, bioelectronics, automotive electronics, photonics, micro-LED, and medical electronics, Green packaging, Renewable energy, Energy storage, Wearable/flexible technologies and Other novel system packaging technologies.

P7. Advanced Sensor & Microsystems Technology (MST)

Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, and Sensing, actuation and control circuits on microsystems.

PCB

B1. Advanced and Green Materials and Process

Green materials(Lead-free, halogen-free, energy saving, recycling and reducing etc.) , Green process and manufacturing , Millimeter-wave materials(low Dk/Df etc.), Low CTE and low water absorption materials, Thermal dissipation materials, Photo and non-photo dielectric materials for high density circuits, and Advanced substrate materials and process.

B2.Test, Quality, Inspection and Reliability

Feature testing and verification, Inspection(AOI, non-destructive testing etc.), Electrical measurement and evaluation, Structure integrity, and Failure mechanism analysis.

B3. HDI, IC Substrate and FPC Technology

SAP and m-SAP process(fine pitch line), Build-up board, Micro-vias and copper plating process, Multilayer core and coreless, Embedded substrate, Advanced flex and rigid-flex, High speed and high frequency circuitry and substrate, and High power and thermal dissipation substrate

B4. Smart Manufacturing and Automation

Mechatronics, Robotics, Control systems, Tele-robotics, Human computer(robot) interaction, Modeling and simulation techniques, Intelligent control and manufacturing, Neuro-control, Fuzzy control and their applications, Automatic control system, and Process integration

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