Celebrate 20 years of pioneering innovation—
join us at IMPACT 2025!
Submit your abstract before June 20 2025
Accepted Papers Will Be included in IEEE Xplore !
Since its inception in 2006, the IMPACT Conference has been at the forefront of technological evolution, fostering innovation in the packaging, PCB, and semiconductor industries. Over the past two decades, IMPACT has not only witnessed but actively contributed to rapid advancements in 5G, AI, high-performance computing (HPC), edge computing, and sustainability. Each year, the conference has adapted to the latest trends, driving forward the conversation on emerging technologies and their industrial applications.
Now in its 20th year, IMPACT 2025 embraces the theme “Energy-Efficient AI: From Cloud to the Edge,” reflecting the industry’s growing emphasis on high-performance, low-power solutions. As AI applications continue to expand—from data centers to edge devices—the need for advanced PCB, IC substrates, heterogeneous integration, and packaging technologies has become increasingly critical.
This milestone year marks not just a celebration of the past 20 years, but a bold step into the future, where IMPACT continues to lead, inspire, and drive innovation. Join us at IMPACT 2025 as we shape the next era of AI, semiconductor packaging, and PCB technology—powering a smarter, more sustainable world.
【Date】Oct. 21st (Tue.)-24th (Fri), 2025
【Venue】Taipei Nangang Exhibition Center
【Theme】Energy efficient AI: From Cloud to the Edge
【Organizer】IEEE-EPS、iMAPS Taiwan、ITRI、TPCA
【Feature】Plenary speech、Industrial session、Special session、Invited talks、PDC
【Exhibition】TPCA Show, TAITRONICS, AIoT Taiwan
【On-line Submission】www.impact.org.tw
【IMPORTANT DATE】
| Item | Date | Remark |
|---|
| Abstract Submission Deadline | Jun. 20 | 400-500 words, 1-2 pages
Submit online www.impact.org.tw |
| Abstract Acceptance Notification | July. 18 | Notice sent via email |
| Advanced Program Online | Aug. 15 | Advanced program announcement |
| Full Paper Submission Deadline | Aug. 22 | 4 pages including figures and tables Submit on-line through the conference website |
|
【SCOPE OF PAPER SOLICITED】
| Packaging | PCB |
|---|
| P1. Advanced Packaging Technologies | B1.Sustainable Materials and Technology |
| P2. Power Electronics Packaging | B2.Smart Manufacturing, Inspection and Testing |
| P3.Interconnections & Nanotechnology | B3.HDI PCB, IC Substrate and FPC Technology |
| P4.Design, Modeling, AI/Machine Learning Applications, and Testing | B4.Advanced and Emerging Technology |
| P5. Advanced Materials, Automatic Process & Assembly | |
| P6. Emerging Systems Packaging Technologies | |
| P7. Sustainable Technologies & Systems | |
* Papers relevant to the above scopes are encouraged to submit but NOT limited to.
* Conference organizer keeps the right to finalize session arrangement.
* Authors of accepted papers including oral presentations and posters should register before the deadline; please be noted that unregistered (paid) papers will be removed from the conference program.
* The organizer reserves the right to modify the agenda.
PAPER AWARD
Outstanding Paper Award will be elected by IMPACT Technical Program Committee from student and industrial papers respectively.
The paper awardees will be announced and honored next year.
Evaluation criteria： Originality, Completeness, Significance, Industrial merit of the abstract, full paper, and presentation.
【20 Years of Evolution and Excellence】
2006 The 1st IMPACT
2007 Packaging and PCB Taiwan
2008 Creative Collaboration, More Than Packaging
2009 IMPACT Your Future: Integration, Efficiency, & the Eco-friendly
2010 Embrace IMPACT, Create Possibilities
2011 IMPACT- Leading Innovation
2012 IMPACT, Inspiring Innovation
2013 Green & Cloud: Creating Value and Toward Eco-Life
2014 Challenges of Change - Shaping the Future
2015 IMPACT on Mobile and Flexible Electronics
2016 IMPACT on the Next Big Things
2017 IMPACT on Intelligence Everything
2018 IMPACT on Artificial Intelligence-Our Future
2019 IMPACT on 5G - Evolution & Revolution
2020 HPC (High Performance Computing)
2021 IMPACT on 5G+
2022 IMPACT 2022 on Empowered Edge Computing
2023 IMPACT on the future of HPC, AI and Metaverse
2024 IMPACT on Sustainable Technology
2025 Energy efficient AI: From Cloud to the Edge