Oral Sessions Back to program

Opening & Award Ceremony 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 09:30 - 09:50 Shin-Puu Jeng, General Chair, IMPACT-IAAC 2026

Plenary Speech I Energy-Efficient AI Hardware - Beyond the Exit of the Device Miniaturization Tunnel by Dr. H.-S. Philip Wong 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 09:50 - 10:40

Plenary Speech II - Optimizing AI System with Advanced Packaging by Dr. C. P. Hung 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 10:40 - 11:30

Plenary Speech III - Advanced Semiconductor Package Substrates for AI and HPC by Mr. Yashushi Araki 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 13:30 - 14:20 Yasumitsu Orii, Rapidus Corporation

【S1】Substrate Ecosystem and Growth: Scaling ABF, Glass, and High-Density IC Substrates for an AI‑Driven World (IAAC) 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 14:40 - 17:40 Rozalia Beica, Rapidus Corporation

Plenary Speech IV - Dr. Rahul Manepalli 701A, 7F, TaiNEX 2 09:00 - 09:50

【S2】Enable Energy Efficient AI Technologies Through Integrated Material Solutions (Qnity) 701A, 7F, TaiNEX 2 10:10 - 12:10 Lucy Wei, Advanced Circuit & Packaging, Qnity / Tim Tsai, Advanced Circuit & Packaging, Qnity

【S3】Compute & Enterprise AI (AMD) 701B, 7F, TaiNEX 2 10:10 - 12:10 Hellen Lo, Advanced Micro Devices, Inc.

【S4】Advanced Packaging ～ Hybrid bonding, Glass core, Fine RDL ～ (ICEP) 701F, 7F, TaiNEX 2 10:10 - 12:10 Yasumitsu Orii, Rapidus Corporation / Yasuhiro Morikawa, ULVAC

【S5】Signal, Power and RF Integrity 701G, 7F, TaiNEX 2 10:10 - 12:10

【S6】Advanced Testing and High-Speed Characterization 701H, 7F, TaiNEX 2 10:10 - 12:10

【S7】Advanced Interconnect Technologies 702, 7F, TaiNEX 2 10:10 - 12:10

【S8】Advanced Package Design and Performance 703, 7F, TaiNEX 2 10:10 - 12:10

Lunch Talk 701A, 7F, TaiNEX 2 12:30 - 12:35

【S9】Glass substrate 701A, 7F, TaiNEX 2 13:00 - 15:00 Tetsuya Onishi, Grand Joint technology Ltd

【S10】Advancements inComponent to SystemIntegration(GEA) 701B, 7F, TaiNEX 2 13:00 - 15:00 Matt Kelly, Global Electronics Association / Jan Vardaman, TechSearch International

【S11】Architecting the Future: AI‑Driven Data Center Systems (Intel) 701F, 7F, TaiNEX 2 13:00 - 15:00 Jimmy Hsu, Intel / Chun Ying Wu, Intel

【S12】Advanced RDL and Fout-Out Technologies for Next-Generation Packaging 701G, 7F, TaiNEX 2 13:00 - 15:00

【S13】AI-Driven Advanced Packaging 701H, 7F, TaiNEX 2 13:00 - 15:00

【S14】Advanced Bonding Technologies 702, 7F, TaiNEX 2 13:00 - 15:00

【S15】Copper Metallization and Surface Finishing 703, 7F, TaiNEX 2 13:00 - 15:00

【Open Seminar I 】Market Trend – SiPh/CPO Heterogeneous Integration in the AI Era: CoPoS × TGV TPCA Show Main Stage (Area L, 4F, TaiNEX1) 14:00 - 16:00 Albert Lan, Applied Materials

Poster Session I 701E, 7F, TaiNEX 2 15:00 - 15:50

【S16】Thermal Session 701A, 7F, TaiNEX 2 15:50 - 17:50 Edward Kung, TTMA / Jimmy Chuang, Intel

【S17】Surround the Glass-Advanced Packaging transition to Glass Core Substrate (MKS' Atotech) 701B, 7F, TaiNEX 2 15:50 - 17:50 Daniel Schmidt, Eddy Chen

【S18】Thinking Big: How Panel-Level Packaging Is Reshaping Heterogeneous Integration 701F, 7F, TaiNEX 2 15:50 - 17:50 Luke Liu, Applied Materials

【S19】Hybrid Bonding for 3D Integration 701G, 7F, TaiNEX 2 15:50 - 17:50 Shih-Kang Lin, National Cheng Kung University

【S20】Design, Test and Reliability 701H, 7F, TaiNEX 2 15:50 - 17:50

【S21】Advanced Materials and Assembly Technologies 702, 7F, TaiNEX 2 15:50 - 17:50

【S22】Sustainable Electronics and Emerging Technologies 703, 7F, TaiNEX 2 15:50 - 17:50

Plenary Speech V - Effects of Aging, Damage, and Crystal Orientation on the Reliability of Solder Joints for Advanced Packaging and Heterogeneous Integration byDr. Jeffrey C. Suhling 701A, 7F, TaiNEX 2 09:00 - 09:50

【S23】ASE 701A, 7F, TaiNEX 2 10:10 - 12:10

【S24】Panel-Level Packaging Meets Heterogeneous Integration (Lam Research) 701B, 7F, TaiNEX 2 10:10 - 12:10

【S25】Glass Technologies for Advanced Packaging 701F, 7F, TaiNEX 2 10:10 - 12:10 Andreas Ostmann, Fraunhofer IZM

【S26】Power Electronics Packaging 701G, 7F, TaiNEX 2 10:10 - 12:10 Li-Cheng Shen, USI

【S27】Interconnection Materials and Assembly 702, 7F, TaiNEX 2 10:10 - 12:10

【S28】High-Speed AI and Data Center PCB Technology 703, 7F, TaiNEX 2 10:10 - 12:10

【S29】Heterogeneous Integration in Advanced Packaging (SPIL) 701A, 7F, TaiNEX 2 13:00 - 15:00

【S30】Advanced Glass and Interposer Technologies for Heterogeneous Integration(Hi-CHIP) 701B, 7F, TaiNEX 2 13:00 - 15:00 Jerry Wang, EOSL, ITRI / Yu-Po Wang, Prismark

【S31】Advanced Packaging Process Technologies 701F, 7F, TaiNEX 2 13:00 - 15:00 Sung-Uk Zhang, Dong-Eui University

【S32】Power Electronics Packaging 701G, 7F, TaiNEX 2 13:00 - 15:00

【S33】Design, Modeling and Simulation 701H, 7F, TaiNEX 2 13:00 - 15:00

【S34】Thermal Characterization and Management 702, 7F, TaiNEX 2 13:00 - 15:00

【S35】Advanced Substrate and Packaging Materials 703, 7F, TaiNEX 2 13:00 - 15:00

Poster Session II 701E, 7F, TaiNEX 2 15:00 - 15:50

【Open Seminar II 】iNEMI – Large Form Factor Package Assembly TPCA Show Main Stage (Area L, 4F, TaiNEX1) 15:00 - 17:00 Haley Fu, iNEMI

【S36】Heterogeneous Integration 701A, 7F, TaiNEX 2 15:50 - 17:50 Shin-Puu Jeng, Applied Materials / Kathy Yan, TSMC

【S37】Thermal Management and Materials for Advanced Semiconductor Packaging(ISMP) 701B, 7F, TaiNEX 2 15:50 - 17:50 Taek-Soo Kim, Korea Advanced Institute of Science and Technology (KAIST)

【S38】Addressing high power consuming systems: Materials & processes research in Japan (JIEP) 701F, 7F, TaiNEX 2 15:50 - 17:50 Takeyasu Saito, Osaka Metropolitan University / Hirokazu Noma, Resonac Corporation

【S39】Advanced Packaging Manufacturing 701G, 7F, TaiNEX 2 15:50 - 17:50

【S40】Modeling and Reliability of Advanced Packaging 701H, 7F, TaiNEX 2 15:50 - 17:50

【S41】Digital Engineering and Process Modeling 702, 7F, TaiNEX 2 15:50 - 17:50

【S42】Smart Manufacturing, Inspection and Testing 703, 7F, TaiNEX 2 15:50 - 17:50

PDC1 - Co-Packaged Optics with Silicon Photonics and Glass Packaging by Dr. John Lau 402bc, 4F, TaiNEX1 10:00 - 12:00  

PDC2 - High Reliability Advanced Semiconductor Soldering by Dr. Ning-Cheng Lee 403, 4F, TaiNEX1 10:00 - 12:00

【Open Seminar III 】IEEE-EPS Distinguished Lecture by Dr. John Lau TPCA Show Main Stage (Area L, 4F, TaiNEX1) 13:00 - 14:00 C. Robert Kao, National Taiwan University