Oral Sessions

Plenary I - Kamheng Lee,Senior Director,TSMC R504abc 10:20 - 11:10 Session Chair : Chih-I Wu, VP, ITRI

Plenary II- ST Liew ,President ,Qualcomm Taiwan R504abc 11:10 - 12:00 Session Chair : K. N. Chiang, Chair Professor, NTHU

S4:Advanced Packaging Ⅰ R503 13:10 - 15:10 Session Chair : Chih Hang Tung, Deputy Director, TSMC/Tz-Cheng Chiu,Professor, NCKU

S1: Packaging Innovations by SPIL R504a 13:10 - 15:10 Session Chair : Yu-Po Wang,SPIL/ Kuoming Chen,UMC

S2:High Speed PCB for Edge Computing Applications by Atotech R504b 13:10 - 15:10 Session Chair : Eddy Chen,Atotech

S3: JIEP R504c 13:10 - 15:10 Session Chair : Takeyasu SAITO,Osaka Prefecture University/ Lewis Huang, Senju

S5: High Density Fan-out Packaging Solution for Chiplets by ASE R504a 15:40 - 17:40 Session Chair : Chen-Chao Wang,ASE

S8:Advanced Design, Modeling & Testing I R503 15:40 - 17:40 Session Chair : Kuoming Chen, Director,UMC / Chang-Chun Lee,Professor, NTHU

S6:Advanced Packaging for Data Center/ Server Applications by Atotech R504b 15:40 - 17:40 Session Chair : Eddy Chen, Atotech

S7: 3D Embedding R504c 15:40 - 17:40 Session Chair : Weita Yang, Industrial Technology Research Insitute

Plenary III- Yee-Wei Huang ,VP,Realtek R504ab 09:00 - 09:40 Session Chair : Wei-Chung Lo, ITRI

S10: Technological Innovation by Nan Ya Plastics R504b 10:00 - 12:00 Session Chair : Gordon Lee, Assistant Department Manager, Nan Ya Plastics

S11:The new metallization process by Reduced Graphene Oxide and its innovative applications on 5G PCB interconnection by TRIALLIAN R504c 10:00 - 12:00 Session Chair : Ding-Chiang Yeh, General Manager, Triallian Corporation

S12:Advanced Bonding and Interconnect Technology R503 10:00 - 12:00 Session Chair : Chih Chen, Distinguished Professor, NYCU / Ting-Li Yang, Professor,NYCU

IEEE-EPS Panel R504a 10:00 - 12:00 Session Chair : C. P Hung, VP, ASE Group 10:00-10:05/ Kitty Pear, IEEE EPS 10:065-10:10

S16:Advanced and Green Materials and Process R503 13:10 - 15:10 Session Chair : Vincent Wei, iCana Limited (Foxconn)/ Kuo-Chan Chiou, ITRI

S14: Intel Modular Data Center Platform Design Architecture R504b 13:10 - 15:10 Session Chair : George Chen, Director, Intel

S15: Fan-Out and Heterogeneous Packaging R504c 13:10 - 15:10 Session Chair : David Tarng, Director, ASE Taiwan / Shih-Kang Lin, Professor, NCKU

S13:ICEP R504a 13:10 - 15:10 Session Chair : Yasumitsu Orii, NAGASE & CO., LTD./ Andy Tsai,NAGASE TAIWAN CO., LTD.

S17: Heterogeneous Integration R504a 15:40 - 17:40 Session Chair : Shin-Puu Jeng, Director, TSMC/Wei-Chung Lo, Deputy General Director, ITRI

S18: Advanced Design, Modeling & Testing II R504b 15:40 - 17:40 Session Chair : Sheng-Jye Hwang, Professor, NCKU / Lewis C.Y.Huang, VP, Senju

S19:Advanced Materials, Automatic Process & Assembly R504c 15:40 - 17:40 Session Chair : Dyi Chung Hu,Siplus / Fan-Yi Ouyang, Professor, NTHU

S20:Test, Quality, Inspection and Reliability R503 15:40 - 17:40 Session Chair : Jeffrey Lee, IST / Yu-Jung Huang, Professor, ISU

Pleanry IV R504a 08:50 - 09:30 Session Chair : Hsien-Chie Cheng, Distinguished Professor, FCU

Pleanry V R504a 09:30 - 10:10 Session Chair : Yu-Hua Chen, VP, Unimicron

S22: Power Electronics R504b 10:30 - 12:30 Session Chair : Albert Wu, Professor, NCU / Allen Liu, ITRI

S23:Advanced Packaging Ⅱ 504c 10:30 - 12:30 Session Chair : CY Yang,Professor, NCU / D. S. Liu, Professor,NCCU

S24: HDI, IC Substrate and FPC Technology 503 10:30 - 12:30 Session Chair : Chi-Shiung Hsi,National United University/ Irving Lee, Global Manager,UL

S21: Market Trend: Innovative More-than-Moore Packaging 504a 10:30 - 12:30 Session Chair : Albert Lan ,Applied Material

S25: Advacned Design & Emerging Modeling 504a 13:30 - 15:30 Session Chair : C.A. Yuan, Assoc. Professor, FCU / K-J Chung, Assoc. Professor,NCUE

S26: Advanced Packagng Process and Design 504b 13:30 - 15:30 Session Chair : MY Tsai , Professor, CGU / Jenn-Ming Song,Professor, NCHU

S27: Advanced Substrate/PCB Process and Manufacturing 504c 13:30 - 15:30 Session Chair : Shu Huang, Division Director,ITRI / John Liu, Consultant, TPCA