Oral Sessions

P1   Plenary Speech I - Dr. Jun He , TSMC R504abc 10:20 - 11:10 Session Chair : Wei-Chung Lo, President, iMAPS Taiwan

P2   Plenary Speech II - Dr. Raja Swaminathan, AMD R504abc 11:10 - 12:00 Session Chair : YH Chen, VP, Unimicron

S1   iNEMI R504a 13:30 - 15:30 Session Chair : Masahiro Tsuriya, iNEMI / Jeffrey Lee, IST

S2   MKS' Atotech- AI Creating a New ERA of Advanced Packaging R504b 13:30 - 15:30 Session Chair : Eddy Chen, MKS' Atotech

S3   Fan-out Packaging&Interconnection R504c 13:30 - 15:30 Session Chair : MY Tsai, Professor, CGU/ D.S. Liu, Professor, CCU,劉德騏

S4   Power Electronics R503 13:30 - 15:30 Session Chair : Shi-Wei Ricky Lee, Professor, HKUST/Allen Liu, ITRI

S5   3D embedding technology and its International Standards toward Edge computing in the HPC, AI & Metaverse society R504a 15:50 - 17:50 Session Chair : Weita Yang,Division Director, ITRI/ Yoshihisa Katoh, Guest Professsor, FUKUOKA-University

S6   IAAC :Technology for Chiplets Interface (iMAPS Taiwan) R504b 15:50 - 17:50 Session Chair : Wei-Chung Lo, iMAPS/ITRI; Chin-Hung Wang, iMAPS/ITRI

S7   Advanced Packaging&Processing R504c 15:50 - 17:50 Session Chair : Albert Wu, Professor, NCU/ Ting-Li Yang,Technical Manager, Mediatek

S8   Power Electronics R503 15:50 - 16:20 Session Chair : C.E. Ho, Professor, YZU/ Chang-Chun Lee,Professor, NTHU

I   IEEE EPS and CEDA Joint Panel_ Co-Design for AI (ASE) R504ab 09:00 - 10:30 Session Chair : CP Hung, VP, ASE

S9   JIEP R504a 10:40 - 12:30 Session Chair : Takeyasu Saito, Osaka Metropolitan University ; Yuki Ishikawa, Sanyu rec co., ltd.

S10   Leading Advanced Packaging (SPIL) R504b 10:40 - 12:30 Session Chair : Yu-Po Wang, SPIL

S11   Advanced Materials, Process Bonding R504c 10:40 - 12:30 Session Chair : David Tarng, Director, ASE/ Shih-Kang Lin, Professor, NCKU

S12   Advanced Interconnection & Reliability R503 10:40 - 12:30 Session Chair : Tz-Cheng Chiu, Professor, NCKU/ Meng-Kai Shih, NFU

S13   ICEP R504a 13:30 - 15:30 Session Chair : Yasumitsu Orii, Rapidus

S14   Intel Data Center Modular Hardware System(Intel) R504b 13:30 - 15:30 Session Chair : George Chen, Intel ; Jimmy Hsu, Intel

S15   Advanced Packaging Material Modeling & Characterization R504c 13:30 - 15:30 Session Chair : Lih Shan Chen, ISU / Hsu, Hsiang-Chen, ISU

S16   Advanced and Green Materials & Process R503 13:30 - 15:30 Session Chair : Kuo-Chan Chiou,ITRI/ Y.-C. Liu, NCKU, 劉禹辰

S17   Heterogeneous Integration R504a 15:50 - 17:50 Session Chair : Shin-Puu Jeng, TSMC

S18   【S18】AI-based Reliability Characterization & Prediction R504b 15:50 - 17:50 Session Chair : Kuoming Chen, Director, UM‪C / ‪Mei-Ling Wu‬, Professor, NSYSU

S19   Advanced Packaging Technologies R504c 15:50 - 17:50 Session Chair : Kuan-Neng Chen, Distinguished Professor,NYCU/ Chih Hang Tung, Deputy Director, TSMC

S20   Test, Inspection & Characterization R503 15:50 - 17:50 Session Chair : Irving Lee, Special Assistant, Zhen Ding/ Yu-Jung Huang, E&R Engineering Corporation

P3   Plenary Speech III - Dr. Beth Keser, iMAPS R504a 09:00 - 09:40 Session Chair : Kuo-Ning Chiang, Chair Professor, NTHU

P4   Plenary Speech IV -Prof. Takayuki Ohba, Tokyo Institute of Technology R504a 09:40 - 10:20 Session Chair : Shin-Puu Jeng, Director , TSMC

S21   Market Trend：Innovative Packaging Technology Applied in AR/VR, AI, and ESG R504a 10:30 - 12:30 Session Chair : Albert Lan, Applied Material

S22   Thermal Modeling &Characterization R504b 10:30 - 12:30 Session Chair : Samy Lin, Intel ; Lin, Wei-Keng, NTHU

S23   High Speed Signal & Interconnect R504c 10:30 - 12:30 Session Chair : Po-Hao Tsai, DUPONT;Shu Huang ,ITRI

S24   Advanced PCB/Substrate & Soldering R503 10:30 - 12:30 Session Chair : Carl E. Chiang, TPCA/ Ra-Min Tain, Manager, Unimocron

S25   JIEP R504a 13:30 - 16:00 Session Chair : Takeyasu Saito, Osaka Metropolitan University / Yuki Ishikawa, Sanyu rec co., ltd.

S26   Design, Modeling &Testing R504b 13:30 - 16:00 Session Chair : Ben-Je Lwo, Professor, NDU/ Cadmus Yuan, FCU

S27   Advanced Packaging & Material Characterization R504c 13:30 - 16:00 Session Chair : C.Y.Huang, VP, Senju/ Jenn-Ming Song, Professor, NCHU

S28   HDI & FPC Technologies R503 13:30 - 16:00 Session Chair : Michael Chang, DuPont Taiwan Limited/ Chien-Lung Liang, Professor, NTUST