Oral Sessions


S21: Market Trend: Innovative More-than-Moore Packaging

Oct. 28, 2022 10:30 AM - 12:30 PM

Room: 504a
Session chair: Albert Lan ,Applied Material

The Prospect of Global and Taiwan Economy
發表編號:S21-1時間:10:30 - 11:00

Invited Speaker

Jiann-Chyuan Wang, CIER

Ⅰ.Bizarre & changeful global economic development

Ⅱ.Global economic perspective

Ⅲ.Taiwan’s economic growth & uncertainty

Ⅳ.Important issues for next 10 years

IC Substrate (ICS)
發表編號:S21-2時間:11:00 - 11:30

Invited Speaker

Hayao Nakahara, President, N.T. Information Ltd. (Onsite Presenter:Shiuh-Kao Chiang , Managing Partner, Prismark )

Of top 25 makers in 2021, 13 are ICS Makers
Number of ICS makers decreases rapidly
Possibility of Recession
2021 IC PKG Substrate Production

The strong impact of compound semiconductors on the packaging industry
發表編號:S21-3時間:11:30 - 12:00

Invited Speaker

Shalu Agarwal, Yole Développement

This presentation will cover the impact of compound semiconductors on the packaging industry. We will outline deployed solutions, highlight the challenges, and analyze the current and expected market situation.

Enable Sustainability in the Electronics Industry
發表編號:S21-4時間:12:00 - 12:30

Invited Speaker

Tim Tsai, Director, DuPont Interconnect Solutions

DuPont Interconnect Solution business aims to be a total solution and system design partner for signal integrity and power transmission, leading in sustainability. The key areas for our sustainable interconnect solutions are innovation for green and sustainable chemistry, enabling the circular economy, and adopting renewable electricity. In 2021 DuPont Interconnect Solution achieved the milestone of 95 percent of global operations powered with renewable electricity. We have set the business ambition of Zero by 2030, reaching carbon neutral operations globally.


Media Partner
Co-hosting Event - TPCA Show 2022