Oral Sessions

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Pleanry V

Oct. 28, 2022 09:30 AM - 10:10 AM

Room: R504a
Session chair: Yu-Hua Chen, VP, Unimicron

Advanced Packaging and Its Impact on Substrate Demand
發表編號:P5-1時間:

Plenary speaker

Shiuh-Kao Chiang , Managing Partner, Prismark

Substrates are a critical component in semiconductor packaging. When multiple high-performance and large body-size ICs are interconnected and integrated in one advanced package, the technical and economic requirements on substrates are monumental. There are a few promising high-performance 2.5D and 3D packaging formats available in the industry now. Interestingly, they all require a relatively sophisticated and large-sized substrate to connect to a system motherboard. As a result, FCBGA substrate demands are surging and substrate capital investments are booming. In this paper, recent developments in advanced packaging will be reviewed. Technology developments and supply capacity expansion of advanced substrates will be discussed.


Short Bio

Dr. Shiuh-Kao Chiang
- BS from National Tsing Hua University and PhD from the Ohio State University.
- Joined Prismark in 1998 and has been one of the Managing Partners for over 20 years.
- Active business consultant in the semiconductor packaging and PCB industry.


 


Organizer
Co-Organizer
        
Media Partner
Co-hosting Event - TPCA Show 2022