Oral Sessions

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P3 Plenary Speech III - Dr. Beth Keser, iMAPS

Oct. 27, 2023 09:00 AM - 09:40 AM

Room: R504a
Session chair: Kuo-Ning Chiang, Chair Professor, NTHU



P4 Plenary Speech IV -Prof. Takayuki Ohba, Tokyo Institute of Technology

Oct. 27, 2023 09:40 AM - 10:20 AM

Room: R504a
Session chair: Shin-Puu Jeng, Director , TSMC



S21 Market Trend:Innovative Packaging Technology Applied in AR/VR, AI, and ESG

Oct. 27, 2023 10:30 AM - 12:30 PM

Room: R504a
Session chair: Albert Lan, Applied Material



S22 Thermal Modeling &Characterization

Oct. 27, 2023 10:30 AM - 12:30 PM

Room: R504b
Session chair: Samy Lin, Intel ; Lin, Wei-Keng, NTHU



S23 High Speed Signal & Interconnect

Oct. 27, 2023 10:30 AM - 12:30 PM

Room: R504c
Session chair: Po-Hao Tsai, DUPONT;Shu Huang ,ITRI



S24 Advanced PCB/Substrate & Soldering

Oct. 27, 2023 10:30 AM - 12:30 PM

Room: R503
Session chair: Carl E. Chiang, TPCA/ Ra-Min Tain, Manager, Unimocron



S25 JIEP

Oct. 27, 2023 13:30 PM - 16:00 PM

Room: R504a
Session chair: Takeyasu Saito, Osaka Metropolitan University / Yuki Ishikawa, Sanyu rec co., ltd.



S26 Design, Modeling &Testing

Oct. 27, 2023 13:30 PM - 16:00 PM

Room: R504b
Session chair: Ben-Je Lwo, Professor, NDU/ Cadmus Yuan, FCU



S27 Advanced Packaging & Material Characterization

Oct. 27, 2023 13:30 PM - 16:00 PM

Room: R504c
Session chair: C.Y.Huang, VP, Senju/ Jenn-Ming Song, Professor, NCHU



S28 HDI & FPC Technologies

Oct. 27, 2023 13:30 PM - 16:00 PM

Room: R503
Session chair: Michael Chang, DuPont Taiwan Limited/ Chien-Lung Liang, Professor, NTUST



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Co-Organizer
        
Media Partner
Co-hosting Event - TPCA Show 2024