S22 ISMP
Oct. 25, 2024 08:20 AM - 10:20 AM
Room: 504A, TaiNEX 1
Session chair： Taek-Soo Kim, KAIST/ Woosung Park, Hanyang University
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S23 Glass Substrate
Oct. 25, 2024 08:20 AM - 10:20 AM
Room: 504B, TaiNEX 1
Session chair： ONISHI Tetsuya, Grand Joint technology
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S24 Interconnections & Nanotechnology
Oct. 25, 2024 08:20 AM - 10:20 AM
Room: 504C, TaiNEX 1
Session chair： Takayuki Ohba, Institute of Science Tokyo / Chien-Lung Liang, NTUST
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S25 HDI, IC Substrate and FPC Technology-2
Oct. 25, 2024 08:20 AM - 10:20 AM
Room: 503, TaiNEX 1
Session chair： Dyi-Chung Hu, Siplus / Michael Chang, Dupont
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S26 Advanced Materials, Automatic Process & Assembly
Oct. 25, 2024 08:20 AM - 10:35 AM
Room: 502, TaiNEX 1
Session chair： Ting-Li Yang, Mediatek / Fan-Yi Ouyang, NTHU
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S27 Heterogeneous Integration
Oct. 25, 2024 10:30 AM - 13:00 PM
Room: 504A, TaiNEX 1
Session chair： Shin-Puu Jeng, TSMC/Kathy Yan, TSMC
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S28 Advanced Packaging Technologies-4
Oct. 25, 2024 10:30 AM - 12:30 PM
Room: 504B, TaiNEX 1
Session chair： Lih-Shan Chen, I-Shou University / Myongchun Koh, Taiyo Ink MFG. Co., Ltd
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S29 Design, Modeling, AI/Machine Learning Applications, and Testing / Smart manufacturing
Oct. 25, 2024 10:30 AM - 12:30 PM
Room: 504C, TaiNEX 1
Session chair： Yu-Jung Huang, I-Shou University / Rozalia Beica, Rapidus
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S30 Advanced and Green Materials and Process-2
Oct. 25, 2024 10:30 AM - 12:30 PM
Room: 503, TaiNEX 1
Session chair： Jenn-Ming Song, National Chung Hsing University / Simon Kuo, Cymmetrik
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S31 Test, Quality, Inspection and Reliability / Smatt Manufacturing
Oct. 25, 2024 10:30 AM - 12:30 PM
Room: 502, TaiNEX 1
Session chair： Jimmy Hsu, Intel Corporation / Kuan-Jung Chung, National Changhua University of Education
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S32 3D embedding technology toward heterogeneous integration
Oct. 25, 2024 13:30 PM - 15:30 PM
Room: 504A, TaiNEX 1
Session chair： Weita Yang, ITRI / Yoshihisa Katoh,FUKUOKA-University
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S33 Design, Modeling, Al/Machine Learning Applications, and Testing /Advanced Process
Oct. 25, 2024 13:30 PM - 15:30 PM
Room: 504B, TaiNEX 1
Session chair： Tz-Cheng Chiu, National Cheng Kung University /Lewis Huang, Senju Electronic (Taiwan) Co.,Ltd
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S34 Interconnections & Nanotechnology & Advanced Materials, Automatic Process & Assembly
Oct. 25, 2024 13:30 PM - 15:30 PM
Room: 504C, TaiNEX 1
Session chair： Chih Hang Tung, TSMC / Cheng-En Ho, Yuan Ze University
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