Packaging towards the Edge
發表編號：S9-1時間：10:10 - 10:35 |
Invited Speaker
Ken Brown, VP Packaging, Intel Corporation
Bringing more powerful processing/computing capabilities closer to every human on the planet, requires significant advancements in Packaging technology to get there. Handling and moving the large central data workloads is especially challenging. This talk will share some of those packaging requirements, and the work in progress to achieve these goals.
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AI Compute on the Edge
發表編號：S9-2時間：10:35 - 10:50 |
Invited Speaker
Albert Liu, CEO, Kneron
1.Why edge computing
1.1Edge AI trend
1.2Edge AI benefit
1.3Edge AI and Cloud
1.4The advantage of Kneron solution
2.Kneron Solution in Edge AI
1.FR & Smart door lock
2.ADAS
3.Smart factory
4.Healthy care
5. The challenge of IC package selection
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Evolving Memory Role for Edge Computing
發表編號：S9-3時間：10:50 - 11:05 |
Invited Speaker
Sierra Lai, Director of DRAM Marketing, Winbond
Memory bandwidth and energy transfer per bit are the key for edge computing, however the solution beyond Moore’s law is the key to boost edge computing performance.
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Panel discussion
發表編號：S9-4時間：11:05 - 12:00 |
Invited Speaker
Moderator: Sam Karikalan, VP of EPS Conference committee
Panelists:
1. Ken Brown, Intel
2. Albert Liu, Kneron
3. Sierra Lai, Winbond
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