Oral Sessions



Oct. 27, 2022 10:00 AM - 12:00 PM

Room: R504a
Session chair: C. P Hung, VP, ASE Group 10:00-10:05/ Kitty Pear, IEEE EPS 10:065-10:10

Packaging towards the Edge
發表編號:S9-1時間:10:10 - 10:35

Invited Speaker

Ken Brown, VP Packaging, Intel Corporation

Bringing more powerful processing/computing capabilities closer to every human on the planet, requires significant advancements in Packaging technology to get there. Handling and moving the large central data workloads is especially challenging. This talk will share some of those packaging requirements, and the work in progress to achieve these goals.

AI Compute on the Edge
發表編號:S9-2時間:10:35 - 10:50

Invited Speaker

Albert Liu, CEO, Kneron

1.Why edge computing
1.1Edge AI trend
1.2Edge AI benefit
1.3Edge AI and Cloud
1.4The advantage of Kneron solution
2.Kneron Solution in Edge AI
1.FR & Smart door lock
3.Smart factory
4.Healthy care
5. The challenge of IC package selection

Evolving Memory Role for Edge Computing
發表編號:S9-3時間:10:50 - 11:05

Invited Speaker

Sierra Lai, Director of DRAM Marketing, Winbond

Memory bandwidth and energy transfer per bit are the key for edge computing, however the solution beyond Moore’s law is the key to boost edge computing performance.

Panel discussion
發表編號:S9-4時間:11:05 - 12:00

Invited Speaker

Moderator: Sam Karikalan, VP of EPS Conference committee

1. Ken Brown, Intel
2. Albert Liu, Kneron
3. Sierra Lai, Winbond


Media Partner
Co-hosting Event - TPCA Show 2022