Oral Sessions

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S13:ICEP

Oct. 27, 2022 13:10 PM - 15:10 PM

Room: R504a
Session chair: Yasumitsu Orii, NAGASE & CO., LTD./ Andy Tsai,NAGASE TAIWAN CO., LTD.

Via filling with high uniformity and flash etching with low surface roughness process for fine line formation
發表編號:S13-1時間:13:10 - 13:34

Invited Speaker

REITO KOBAYASHI, JCU CORPORATION

Flip chip ball grid alley (FC-BGA) substrate is well known as a package to connect semiconductor and mother board. And these substrates are produced by semi-additive process (SAP). Recently, with the high functionality is required for server and PC, FC-BGA substrate is also rapidly required to be high densification and functionality. Especially, flatness, planer filling and uniformity are necessary for copper plating and suppressing transmission loss and no undercut are necessary for flash etching. To meet these demands, we have developed new copper plating process and flash etching process.


 
Novel thermosetting film for reducing transmission loss
發表編號:S13-2時間:13:34 - 13:58

Invited Speaker

Meiten Koh, Director, Ph.D, TAIYO INK.MFG

There were increasing demand for decreasing transmission loss at mm wavelength application. In order to reduce dielectric loss, it was preferable to use a material with lower Dk/Df compared to conventionally used epoxy film for circuit board and interlayer insulation film. Since the dielectric loss of the epoxy resin film was particularly worse at high temperature and high humidity, a material with stable dielectric loss even at high temperature and high humidity was desired. Thermoplastic resins such as LCP and PPE have been proposed as candidates, but these resins had inferior in process ability and reliability due to their thermoplasticity. We have synthesized a new thermosetting copolymer based on PPE, which showed excellent dielectric properties. And by blending this resin as a base, we have developed a new thermosetting film that has excellent dielectric properties even under high temperature and high humidity conditions, as well as process ability and reliability equivalent to epoxy resin films. In this presentation, I will describe the development and various characteristics of the new film.


 
PacTech’s Heterogeneous Integration ToolBox
發表編號:S13-3時間:13:58 - 14:22

Invited Speaker

Thomas Oppert, VP Global Sales, PacTech

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(coming soon)
發表編號:S13-4時間:14:22 - 14:46

Invited Speaker

1. Tatsuya Shimura,President / 2.Keigo Imoto,Group Manager ,Yamaha Robotics Taiwan Co., Ltd.

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(coming soon)
發表編號:S13-5時間:14:46 - 15:10

Invited Speaker

Speaker 5

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Organizer
Co-Organizer
        
Media Partner
Co-hosting Event - TPCA Show 2022