As silicon technology scaling continues, heterogeneous integration of silicon chiplets gains increasing significance to not only enhance yield, but also to increase design flexibility, reusability, and overall performance. The speech will touch on the TSMC’s efforts in the development of 3DFabric advanced packaging technology, covering 2D, 2.5D and 3D integration to deliver industry-leading performance. It will also touch on the transformation of backend manufacturing to adopt advanced automation to deliver a robust manufacturing process for advanced packaging.