As silicon technology scaling continues, heterogeneous integration of silicon chiplets gains increasing significance to not only enhance yield, but also to increase design flexibility, reusability, and overall performance. The speech will touch on the TSMC’s efforts in the development of 3DFabric advanced packaging technology, covering 2D, 2.5D and 3D integration to deliver industry-leading performance. It will also touch on the transformation of backend manufacturing to adopt advanced automation to deliver a robust manufacturing process for advanced packaging.
Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier this year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.