Op Opening & Award Ceremony-(2024 Best Paper Award)
Oct. 21, 2025 09:30 AM - 09:40 AM
Room: 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B)
Session chair： Shih-Chieh Chang, Ph.D. General Chair of IMPACT 2025
|
PL1 Plenary Speech I: Enabling energy-efficient AI with Semiconductor Innovations. Frank J.C. Lee/TSMC
Oct. 21, 2025 09:40 AM - 10:30 AM
Room: 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B)
Session chair： Shih Chieh Chang/ITRI
|
PL2 Plenary Speech II: Future Packaging/System Challenges for AI Data Centers. Babak Sabi/AWS
Oct. 21, 2025 10:30 AM - 11:20 AM
Room: 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B)
Session chair： Kathy Yan/TSMC
|
PL3 Plenary Speech III: Architecting the Future: Innovations in Scalable Data Center Design. Jatin Upadhyay/Intel
Oct. 21, 2025 11:20 AM - 12:10 PM
Room: 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B)
Session chair： Robert Lo/ITRI, EOSL
|
OS1 【S1】Strategic Breakthroughs in High-Density Server Design: Elevating Compatibility and Performance (Intel)
Oct. 21, 2025 13:00 PM - 15:00 PM
Room: 504 a, TaiNEX 1
Session chair： George Chen/Intel, Falconee Lee/Intel
|
OS2 【S2】Enabling AI and HPC: Technology Inflections Across Advanced Packaging and Interconnect (MKS 'Atotech)
Oct. 21, 2025 13:00 PM - 15:00 PM
Room: 504 b, TaiNEX 1
Session chair： Daniel Schmidt and Eddy Chen/MKS' Atotech
|
OS3 【S3】Component to System-Level Integration (GEA)
Oct. 21, 2025 13:00 PM - 15:00 PM
Room: 504 c, TaiNEX 1
Session chair： Dr. Devan Iyer, PhD/Global Electronics Association
|
OS4 【S4】Cu-Cu & Hybrid Bonding
Oct. 21, 2025 13:00 PM - 15:00 PM
Room: 503, TaiNEX 1
Session chair： Jenn-Ming Song/NCHU, Shih-kang Lin/NCKU
|
OS5 【S5】Advanced Characterization & Materials Behavior in Electronic Packaging
Oct. 21, 2025 13:00 PM - 15:00 PM
Room: 502, TaiNEX 1
Session chair： Alex King/Taimide Tech. Inc., Kuo-Chan Chiou/ITRI
|
PS1 Poster session (Packaging)
Oct. 21, 2025 15:00 PM - 15:30 PM
Room: TaiNEX 1, 5F
Session chair： Hsien Chie Cheng/Feng Chia Uni, Hsiang-Chen Hsu/I-Shou University, John Liu/TPCA,Hideyuki Nishida/SMIC
|
OS6 【S6】AMD Server Solution Customer SI+EV Enablement (AMD)
Oct. 21, 2025 15:30 PM - 17:30 PM
Room: 504 a, TaiNEX 1
Session chair： Hellen Lo/AMD, YL Li/AMD
|
OS7 【S7】AI Packaging Supply Chain Ecosystem & Driving Technology (Applied Materials)
Oct. 21, 2025 15:30 PM - 17:30 PM
Room: 504 b, TaiNEX 1
Session chair： Albert Lan/Applied Materials
|
OS8 【S8】Thermal-Mechanical Modeling & Simulation I
Oct. 21, 2025 15:30 PM - 17:45 PM
Room: 504 c, TaiNEX 1
Session chair： Kuo-Ming Chen/UMC, Yan-Cheng Liu/ITRI
|
OS9 【S9】Interconnections & Nanotechnology
Oct. 21, 2025 15:30 PM - 17:45 PM
Room: 503, TaiNEX 1
Session chair： Chien-Lung Liang/NTUST, Takayuki Ohba/Institute of Science Tokyo
|
OS10 【S10】Metallization & Advanced Substrate Process Integration
Oct. 21, 2025 15:30 PM - 17:45 PM
Room: 502, TaiNEX 1
Session chair： Michael Chang/Qnity™, DuPont Electronics, Shan-Jen, KUO (Simon) /Cymmetrik
|