P1 Plenary Speech I
Oct. 23, 2024 10:20 AM - 11:10 AM
Room: 701EF, TaiNEX 2
Session chair： Yasumitsu Orii, Rapidus
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P2 Plenary Speech II
Oct. 23, 2024 11:10 AM - 12:00 PM
Room: 701EF, TaiNEX 2
Session chair： Shin-Puu Jeng, TSMC
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S1 Intel - Ecosystem Enabling for Intel Data Center AI Server Solutions
Oct. 23, 2024 13:30 PM - 15:30 PM
Room: 504A, TaiNEX 1
Session chair： Jimmy Hsu, intel / George Chen, intel
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S2 MKS’ Atotech - Advancing AI chips from silicon to PCB
Oct. 23, 2024 13:30 PM - 15:30 PM
Room: 504B, TaiNEX 1
Session chair： Eddy Chen, MKS’ Atotech
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S3 Advanced Packaging Technologies-1
Oct. 23, 2024 13:30 PM - 15:30 PM
Room: 504C, TaiNEX 1
Session chair： Andrew Tay, National Singapore University / Ming-Yi Tsai, Chang Gung University
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S4 Design, Modeling, AI/Machine Learning Applications, and Testing -1
Oct. 23, 2024 13:30 PM - 15:30 PM
Room: 503, TaiNEX 1
Session chair： Dongkai Shangguan, Indium Corp. / Sheng-Jye Hwang, National Cheng Kung University
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S5 Sustainable Technologies & Systems
Oct. 23, 2024 13:30 PM - 15:30 PM
Room: 502, TaiNEX 1
Session chair： Alex King, Taimide Tech. Inc. / Kuo-Chan Chiou, ITRI
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S6 AMD - Server Solution Customer SI+EV Enablement
Oct. 23, 2024 16:00 PM - 18:00 PM
Room: 504A, TaiNEX 1
Session chair： Hellen Lo, AMD / YL Li, AMD
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S7 JIEP- Topics for advanced packaging processes in Japan
Oct. 23, 2024 16:00 PM - 18:00 PM
Room: 504B, TaiNEX 1
Session chair： Takeyasu Saito, Osaka Metropolitan University / Yuki Ishikawa, Sanyu rec Co.,Ltd
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S8 Advanced Packaging Technologies-2
Oct. 23, 2024 16:00 PM - 18:00 PM
Room: 504C, TaiNEX 1
Session chair： Andreas Ostmann, Fraunhofer IZM / Shih-Kang Lin, National Cheng Kung University
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S9 HDI, IC Substrate and FPC Technology-1
Oct. 23, 2024 16:00 PM - 18:00 PM
Room: 503, TaiNEX 1
Session chair： Yu-Hua Chen, Unimicron / Nishimura Yoshio, Ajinomoto Co., Inc.
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S10 Power Electronics Packaging-1
Oct. 23, 2024 16:00 PM - 18:00 PM
Room: 502, TaiNEX 1
Session chair： Li-Cheng Shen, USI / Chi-Chuan Wang, National Yang Ming Chiao Tung University
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