Program

  

IMPACT Final Program_1213 updated 

Oral Session      Poster Session

Final Program Download

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For any inquriy, please contact IMPACT Secretariat via email(service@impact.org.tw) or phone(+886-3-3815659#407) 

Program of IMPACT 2021
TimeTuesday, December 21TimeWednesday, December 22TimeThursday, December 23
　R504abc　R504ab　R504a
10:00-11:00Opening & Award Ceremony09:50-11:10IEEE-EPS Panel (hybrid)
ASE Group, Broadcom, GIT, Qualcomm, WIN Semi.*ONSITE ONLY*		09:00-09:40Plenary Speech IV
Dr. Shintaro Yamamichi, Sr. Manager, IBM Research
Topic: The First Quantum Computer Installed in Japan
(10:00-10:30)

<Plenary Speech I> (10:30-11:10)
Dr. Shin-Puu Jeng, Director, TSMC
Topic: Recent Advancement in Organic Interposer Technology*ONSITE ONLY*

09:40-10:20Plenary Speech V
Dr. Hsing Horng Lee, Vice CSO, Unimicron
Topic: 5G AiP Substrate Package and Related Application
11:10-11:40Plenary Speech II
Dr. Paul Hale, Chief of the RF Technology Division, NIST
Topic: SI Traceability for 5G Hardware Authentication		11:00-12:00Foyer area10:20-12:20R503R504aR504b
Poster session (PCB&Packaging)【S17】【S18】【S19】
11:40-12:20Plenary Speech III
Dr. Akshay Singh, Vice President, Micron
Topic: Enabling Technologies for High Performance Memory Solutions in the Age of Data		Market trend Sponsor by ChipMosHeterogeneous integrationAdvanced Packaging Technologies -3
12:20-13:20Lunch12:00-13:20Lunch12:20-13:20Lunch
13:20-15:20R503R504aR504bR504c13:20-15:20R503R504aR504bR504c13:20-15:20R503R504aR504b
【S1】【S2】【S3】【S4】【S9】【S10】【S11】【S12】【S20】【S21】【S22】
Test, Inspection and Measurement for 5G+ by iNEMIEmerging Technologies by SPILAdvanced Packaging Technologies -1Test, Quality, AOI, Inspection and ReliabilityICEPB5G SiP by ASEModeling, Simulation & Design-1Advanced and Green Materials and ProcessThermal ManagementModeling, Simulation & Design-2HDI Technology
15:20-15:40Break15:20-15:40Break　　　　
15:40-17:40【S5】【S6】【S7】【S8】15:40-17:40【S13】【S14】【S15】【S16】　　　　
JIEPInnovation and Technology by Nanya PlasticAdvanced Packaging Technologies -2Test & ReliabilityEmbeddedNext generation package substrates to support HPC by AtotechAdvanced Materials, Automatic Process & AssemblyElectroplating and Electrochemical Processing Technology　　　　
　　　　
　　　　
18:00-20:00x18:00-20:00IMPACT International Welcome Dinner
(Invited only)		　　　　

Organizer
Co-Organizer
      
Co-hosting Event - TPCA Show 2021