IMPACT Final Program_1213 updated 

Oral Session      Poster Session

Final Program Download

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Program of IMPACT 2021
TimeTuesday, December 21TimeWednesday, December 22TimeThursday, December 23
 R504abc R504ab R504a
10:00-11:00Opening & Award Ceremony09:50-11:10IEEE-EPS Panel (hybrid)
ASE Group, Broadcom, GIT, Qualcomm, WIN Semi.*ONSITE ONLY*
09:00-09:40Plenary Speech IV
Dr. Shintaro Yamamichi, Sr. Manager, IBM Research
Topic: The First Quantum Computer Installed in Japan

<Plenary Speech I> (10:30-11:10)
Dr. Shin-Puu Jeng, Director, TSMC
Topic: Recent Advancement in Organic Interposer Technology*ONSITE ONLY*

09:40-10:20Plenary Speech V
Dr. Hsing Horng Lee, Vice CSO, Unimicron
Topic: 5G AiP Substrate Package and Related Application
11:10-11:40Plenary Speech II
Dr. Paul Hale, Chief of the RF Technology Division, NIST
Topic: SI Traceability for 5G Hardware Authentication
11:00-12:00Foyer area10:20-12:20R503R504aR504b
Poster session (PCB&Packaging)【S17】【S18】【S19】
11:40-12:20Plenary Speech III
Dr. Akshay Singh, Vice President, Micron
Topic: Enabling Technologies for High Performance Memory Solutions in the Age of Data
Market trend Sponsor by ChipMosHeterogeneous integrationAdvanced Packaging Technologies -3
Test, Inspection and Measurement for 5G+ by iNEMIEmerging Technologies by SPILAdvanced Packaging Technologies -1Test, Quality, AOI, Inspection and ReliabilityICEPB5G SiP by ASEModeling, Simulation & Design-1Advanced and Green Materials and ProcessThermal ManagementModeling, Simulation & Design-2HDI Technology
JIEPInnovation and Technology by Nanya PlasticAdvanced Packaging Technologies -2Test & ReliabilityEmbeddedNext generation package substrates to support HPC by AtotechAdvanced Materials, Automatic Process & AssemblyElectroplating and Electrochemical Processing Technology    
18:00-20:00x18:00-20:00IMPACT International Welcome Dinner
(Invited only)

Media Partner
Co-hosting Event - TPCA Show 2022