Oral Sessions


S17: Heterogeneous Integration

Oct. 27, 2022 15:40 PM - 17:40 PM

Room: R504a
Session chair: Shin-Puu Jeng, Director, TSMC/Wei-Chung Lo, Deputy General Director, ITRI

Drivers and Challenges for Next Generation Packaging
發表編號:S17-1時間:15:40 - 16:10

Invited Speaker

Jan Vardaman, President, TechSearch International

Performance, time-to-market, and sustainability are the drivers for next generation packaging. Advanced packaging in the form of chiplets is becoming increasingly important, but there is no one solution that meets all needs. For some applications, 3D with hybrid bonding is the solution, but there are many challenges. Challenges such as design, test, assembly, and thermal are discussed. Choices for the future path are discussed.

Innovative Packaging Process and Tool Technology Solutions for CMOS Image Sensor
發表編號:S17-2時間:16:10 - 16:40

Invited Speaker

Albert Lan, Global Sr Packaging Account TD Head, Applied Materials Taiwan, LTD.

CIS (CMOS Image Sensor) has been widely used in many electronic appliances, including mobile, camera, desktop/laptop computer, security, and some other consumable devices. However, with high image resolution requirements in CIS, some unique Heterogenous Integration Packaging technologies, such as Through Si Via (TSV) or Wafer to Wafer (W2W) Hybrid Bonding are poised here to help enhancing the performance of CIS device applications.
In this presentation, full range types of CIS (such as FSI – Front Side Illumination and BSI – Back Side Illumination), its technology market trends, as well as process flow and challenges will be briefly addressed. By the way, we will also discuss how Applied Materials to offer a full dimension aspect of differentiated manufacturing and metrology equipment solutions, such as PVD, ECD, Etch, CVD, and CMP to full fill Through Si Via (TSV) and Hybrid Bonding technologies which are required for CIS device appliances currently and for the future.

Die Bonding Technology to Enable Advanced Packaging
發表編號:S17-3時間:16:40 - 17:10

Invited Speaker

Ami Eitan, Director, TSMC

Advanced packaging is introducing exciting opportunities to product designers, to drive forward overall product performance in all application segments. Different die types are integrated in optimized manner, with various geometrical configurations (Examples- INFO, CoWoS). Furthermore, die and substrate warpage, die sizes, pitch scaling, are some of key technical challenges that need to be addressed. To bring these advanced packaging opportunities to reality, and enable high design flexibility, special attention needs to be drawn to the die bonding technology to be applied. This talk will be focused on the approaches for well-controlled die bonding, to address the advanced packaging challenges. Thermocompression bonding, with its unique features and control knobs, will be of main focus of the talk, in addition to other emerging bonding technologies.

Enabling Heterogeneous Integration through Advanced Interconnect Technologies
發表編號:S17-4時間:17:10 - 17:30

Invited Speaker

Rozalia Beica, CSO, AT&S China

The continuous growth in data generated and computing needs, global network traffic and digital transformation are further driving the adoption of electronics & semiconductor devices. The need for more performing and smarter devices, with increased functionalities, that can address high bandwidth needs, faster speeds, with more efficient power consumption is driving the industry to further develop new and innovative technologies, many of which are enabled by organic substrates. The presentation will focus on global market trends highlighting the major semiconductor industry trends and applications, the increased need and growth of heterogeneous integration and the importance of advanced interconnect solutions.


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