I IEEE EPS and CEDA Joint Panel_ Co-Design for AI (ASE)
Oct. 26, 2023 09:00 AM - 10:30 AM
Room: R504ab
Session chair： CP Hung, VP, ASE
|
S9 JIEP
Oct. 26, 2023 10:40 AM - 12:30 PM
Room: R504a
Session chair： Takeyasu Saito, Osaka Metropolitan University ; Yuki Ishikawa, Sanyu rec co., ltd.
|
S10 Leading Advanced Packaging (SPIL)
Oct. 26, 2023 10:40 AM - 12:30 PM
Room: R504b
Session chair： Yu-Po Wang, SPIL
|
S11 Advanced Materials, Process Bonding
Oct. 26, 2023 10:40 AM - 12:30 PM
Room: R504c
Session chair： David Tarng, Director, ASE/ Shih-Kang Lin, Professor, NCKU
|
S12 Advanced Interconnection & Reliability
Oct. 26, 2023 10:40 AM - 12:30 PM
Room: R503
Session chair： Tz-Cheng Chiu, Professor, NCKU/ Meng-Kai Shih, NFU
|
S13 ICEP
Oct. 26, 2023 13:30 PM - 15:30 PM
Room: R504a
Session chair： Yasumitsu Orii, Rapidus
|
S14 Intel Data Center Modular Hardware System(Intel)
Oct. 26, 2023 13:30 PM - 15:30 PM
Room: R504b
Session chair： George Chen, Intel ; Jimmy Hsu, Intel
|
S15 Advanced Packaging Material Modeling & Characterization
Oct. 26, 2023 13:30 PM - 15:30 PM
Room: R504c
Session chair： Lih Shan Chen, ISU / Hsu, Hsiang-Chen, ISU
|
S16 Advanced and Green Materials & Process
Oct. 26, 2023 13:30 PM - 15:30 PM
Room: R503
Session chair： Kuo-Chan Chiou,ITRI/ Y.-C. Liu, NCKU, 劉禹辰
|
S17 Heterogeneous Integration
Oct. 26, 2023 15:50 PM - 17:50 PM
Room: R504a
Session chair： Shin-Puu Jeng, TSMC
|
S18 【S18】AI-based Reliability Characterization & Prediction
Oct. 26, 2023 15:50 PM - 17:50 PM
Room: R504b
Session chair： Kuoming Chen, Director, UMC / Mei-Ling Wu, Professor, NSYSU
|
S19 Advanced Packaging Technologies
Oct. 26, 2023 15:50 PM - 17:50 PM
Room: R504c
Session chair： Kuan-Neng Chen, Distinguished Professor,NYCU/ Chih Hang Tung, Deputy Director, TSMC
|
S20 Test, Inspection & Characterization
Oct. 26, 2023 15:50 PM - 17:50 PM
Room: R503
Session chair： Irving Lee, Special Assistant, Zhen Ding/ Yu-Jung Huang, E&R Engineering Corporation
|