P3 Plenary III
Oct. 24, 2024 09:00 AM - 09:50 AM
Room: 504, TaiNEX 1
Session chair： Kuo-Ning Chaing, NTHU
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P4 Plenary IV
Oct. 24, 2024 09:50 AM - 10:40 AM
Room: 504, TaiNEX 1
Session chair： Wei-Chung Lo, ITRI
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S11 IEEE EPS Panel - Heterogeneous Integration Roadmap Compact Session
Oct. 24, 2024 10:40 AM - 12:10 PM
Room: 504AB, TaiNEX 1
Session chair： CP Hung, ASE Group
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S12 DUPONT - Shaping Our Future with AI by Next-Gen Substrate and Packaging
Oct. 24, 2024 13:30 PM - 15:30 PM
Room: 504A, TaiNEX 1
Session chair： Lucy Wei, DUPONT / Jason Chuang, DUPONT
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S13 Market trend-Innovative 3D IC Heterogeneous Integration Packaging
Oct. 24, 2024 13:30 PM - 15:30 PM
Room: 504B, TaiNEX 1
Session chair： Albert Lan, Applied Materials
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S14 ICEP
Oct. 24, 2024 13:30 PM - 15:30 PM
Room: 504C, TaiNEX 1
Session chair： Yasumitsu Orii, Rapidus /Yasuhiro morikawa, ULVAC, Inc
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S15 Advanced Packaging Technologies-3
Oct. 24, 2024 13:30 PM - 15:30 PM
Room: 503, TaiNEX 1
Session chair： Po-Hao Tsai, Applied Materials / Haley Fu, iNEMI
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S16 Design, Modeling, AI/Machine Learning Applications, and Testing -2
Oct. 24, 2024 13:30 PM - 15:30 PM
Room: 502, TaiNEX 1
Session chair： Meng-Kai Shih, National Sun Yat-sen University / Shu-Shen Yeh, Google
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S17 SPIL- Advanced Packaging
Oct. 24, 2024 16:00 PM - 18:00 PM
Room: 504A, TaiNEX 1
Session chair： Yu Po Wang, SPIL /Kuo Ming Chen, UMC
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S18 SMTA
Oct. 24, 2024 16:00 PM - 18:00 PM
Room: 504B, TaiNEX 1
Session chair： Jeffrey Lee, Integrated Service Technology Inc.
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S19 Power Electronics Packaging-2
Oct. 24, 2024 16:00 PM - 18:00 PM
Room: 504C, TaiNEX 1
Session chair： Chun-Kai Liu, ITRI / Chang-Chun Lee, National Tsing Hua University
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S20 Advanced and Green Materials and Process-1
Oct. 24, 2024 16:00 PM - 18:00 PM
Room: 503, TaiNEX 1
Session chair： Jason Lee, Boardtek Electronics / Carl E. Chiang, TPCA
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S21 Test, Quality, Inspection and Reliability / Simulation
Oct. 24, 2024 16:00 PM - 18:00 PM
Room: 502, TaiNEX 1
Session chair： Ben-Je Lwo, National Defense University / De-Shin Liu, NCCU
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