Oral Sessions



Oct. 26, 2022 13:10 PM - 15:10 PM

Room: R504c
Session chair: Takeyasu SAITO,Osaka Prefecture University/ Lewis Huang, Senju

Energy Harvesting by Daily Humidity Cycle
發表編號:S3-1時間:13:10 - 13:34

Invited Speaker

Yusuke Komazaki, Researcher, National Institute of Advanced Industrial Science and Technology (AIST)

To power enormous numbers of IoT devices, energy harvesting has great importance. In this presentation, we will present our hygroelectric cell (HEC) technology, which enables ubiquitous energy harvesting by humidity change, based on the combination of concentration cell and deliquescent solution.

Plasma technique for advanced package product
發表編號:S3-2時間:13:34 - 13:58

Invited Speaker

Daisuke Hironiwa, Plasma technique for advanced package product, ULVAC

As electronics devices becomes more high performance, energy efficient, and diversified, more complex and finer packaging structures and more diversified materials are being actively studied.
Against this background, plasma technology is being actively employed in the manufacturing process of high-density packaging products.
In this presentation, I will introduce various plasma processing technology for advanced package product.

Design of Strong Interfaces by Use of Materials Informatics Based on Molecular Simulation
發表編號:S3-3時間:13:58 - 14:22

Invited Speaker

Tomio Iwasaki , Dr.,Hitachi, Ltd.

In order to introduce environmentally compatible and biocompatible materials into future devices, it is necessary to ensure the adhesion between such materials and surrounding materials. Therefore, we have developed a materials informatics design technology that improves the adhesion strength between environmentally friendly and biocompatible materials and metals, ceramics, and resins. In this technology, the material composition that enhances the peeling energy is derived by analyzing the peeling energy data by the molecular simulation by the orthogonal array and the response surface methodology. We will introduce an example of designing ceramics and metals with excellent adhesion strength to DNA materials, which are being studied as environmentally compatible and biocompatible materials, using this technology. In addition, we will introduce an example of designing a peptide material with strong adhesion strength to resin for devices.

Investigation of bonding strength improvement mechanism for sintering Ag by Zn / Ag plating
發表編號:S3-4時間:14:22 - 14:46

Invited Speaker

Ryohei Ueyama

In recent years, effective use of electric energy is an important issue from the viewpoint of global environmental protection. Therefore, power modules, which are key parts of power electronics technology, are strongly required to be highly efficient and highly reliable. These power modules are now required to have a high level of reliability under severe temperature conditions, mainly in the field of automotive equipment. In addition, due to the European RoHS regulations, practical application of sintered Ag bonding materials is required as a substitute for conventional Pb-based solder. Although this sintered Ag bonding material has higher thermal conductivity than solder, it requires a high-pressure process to increase its strength, and there is a risk of damaging the device. Therefore, Zn, which has a large solid solubility limit in Ag, is diffused to improve the strength of sintered Ag joints at low-pressure process.

Recent Development of Fine Pattern Capable RDL Materials
發表編號:S3-5時間:14:46 - 15:10

Invited Speaker

MasaoTomikawa, Director, Toray Industries Inc.

Fine pattern capable positive and negative tone PSPIs were developed. The materials shows good electro-insulation reliability under Bias HAST condition.


Media Partner
Co-hosting Event - TPCA Show 2022