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IMPACT-EMAP 2020 Final Program (updated on Oct 14th)

*IMPACT-EMAP committee reserves the right to modify 

Plenary IndustrialSpecialPackagingPCBPoster
TimeWednesday October 21TimeThursday October 22TimeFriday October 23
 Room 504abc Room 504ab Room 504ab
10:00-11:20Joint Opening & Award Ceremony(10:00-10:30)09:00-09:50<Plenary Speech III>
Dr. CP Hung, Vice President, ASE Group
Topic:Now and Future SiP for Double HI
09:20-10:10<Plenary Speech V>
Mr. David Chang, Senior Managing Consultant, IBM Taiwan
Topic: Impact of Connected Manufacturing in the New 5G Era
<Plenay I>(10:30-11:20)
Dr. Marvin Liao, Vice President, TSMC
Topic: 3D Advanced Packaging Technology and Manufacturing
11:20-12:10<Plenary Speech II>
Dr. John Lau, CTO, Unimicron
Topic:Heterogeneous Integration for HPC Application Driven by AI and 5G
10:00-10:50<Plenary Speech IV>
Dr. Wenchi Ting, Vice President, UMC
Topic: Emergent Memory Technology at the Crossroads
10:30-12:35R504aR504bR504c
【S19】【S20】【S21】
11:00-12:00Foyer areaHeterogeneous Integration-23D EmbeddingMachine Learning Application
【Poster session】 (PCB&Packaging)
12:00-13:10Lunch12:00-13:10Lunch12:20-13:30Lunch
13:10-15:10R504aR504bR504cR50313:10-15:10R504aR504bR504cR503R502 
【S1】【S2】【S3】【S4】【S9】【S10】【S11】【S12】【S13】
HPC by AtotechJIEP Advanced Packaging 1Advanced and Green Materials and ProcessAI Technology by ASENew Materials for Next Generation by Nan ya plasticPower Eletronic Packaging Advanced Materials and ProcessHDI Technology
15:10-15:40Coffee break15:10-15:40Coffee break
15:40-17:40【S5】【S6】【S7】【S8】15:40-17:40【S14】【S15】【S16】【S17】【S18】
SiP by SPILSignal and Power IntegrityWarpage Characterization Test, Quality, AOI, Inspection and ReliabilityHeterogeneous Integration-1ICEPDesign, Modeling & TestingAdvanced Packaging 2Electro Deposition and Electrochemical Processing Technology
18:00-20:00x18:00-20:00International Welcome Dinner
(Invited only)

Organizer
Co-Organizer
        
Media Partner
Co-hosting Event - TPCA Show 2022