Oral Sessions Back to program

Opening & Award Ceremony-(2024 Best Paper Award) 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 09:30 - 09:40 Shih-Chieh Chang, Ph.D. General Chair of IMPACT 2025

Plenary Speech I: Enabling energy-efficient AI with Semiconductor Innovations. Frank J.C. Lee/TSMC 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 09:40 - 10:30 Shih Chieh Chang/ITRI

Plenary Speech II: Future Packaging/System Challenges for AI Data Centers. Babak Sabi/AWS 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 10:30 - 11:20 Kathy Yan/TSMC

Plenary Speech III: Architecting the Future: Innovations in Scalable Data Center Design. Jatin Upadhyay/Intel 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B) 11:20 - 12:10 Robert Lo/ITRI, EOSL

【S1】Strategic Breakthroughs in High-Density Server Design: Elevating Compatibility and Performance (Intel) 504 a, TaiNEX 1 13:00 - 15:00 George Chen/Intel, Falconee Lee/Intel

【S2】Enabling AI and HPC: Technology Inflections Across Advanced Packaging and Interconnect (MKS 'Atotech) 504 b, TaiNEX 1 13:00 - 15:00 Daniel Schmidt and Eddy Chen/MKS' Atotech

【S3】Component to System-Level Integration (GEA) 504 c, TaiNEX 1 13:00 - 15:00 Dr. Devan Iyer, PhD/Global Electronics Association

【S4】Cu-Cu & Hybrid Bonding 503, TaiNEX 1 13:00 - 15:00 Jenn-Ming Song/NCHU, Shih-kang Lin/NCKU

【S5】Advanced Characterization & Materials Behavior in Electronic Packaging 502, TaiNEX 1 13:00 - 15:00 Alex King/Taimide Tech. Inc., Kuo-Chan Chiou/ITRI

Poster session (Packaging) TaiNEX 1, 5F 15:00 - 15:30 Hsien Chie Cheng/Feng Chia Uni, Hsiang-Chen Hsu/I-Shou University, John Liu/TPCA,Hideyuki Nishida/SMIC

【S6】AMD Server Solution Customer SI+EV Enablement (AMD) 504 a, TaiNEX 1 15:30 - 17:30 Hellen Lo/AMD, YL Li/AMD

【S7】AI Packaging Supply Chain Ecosystem & Driving Technology (Applied Materials) 504 b, TaiNEX 1 15:30 - 17:30 Albert Lan/Applied Materials

【S8】Thermal-Mechanical Modeling & Simulation I 504 c, TaiNEX 1 15:30 - 17:45 Kuo-Ming Chen/UMC, Yan-Cheng Liu/ITRI

【S9】Interconnections & Nanotechnology 503, TaiNEX 1 15:30 - 17:45 Chien-Lung Liang/NTUST, Takayuki Ohba/Institute of Science Tokyo

【S10】Metallization & Advanced Substrate Process Integration 502, TaiNEX 1 15:30 - 17:45 Michael Chang/Qnity™, DuPont Electronics, Shan-Jen, KUO (Simon) /Cymmetrik

Plenary Speech IV:The need for chiplet-based SoC technologies in the automotive industry. Takao Iwaki/MIRISE Technologies Corporation 504, TaiNEX 1 09:00 - 09:50 Yasumitsu Orii/Rapidus Corporation

【S11】ICEP-Advanced Packaging and Metrology Technologies 504 a, TaiNEX 1 10:10 - 12:10 Yasumitsu Orii/Rapidus, Yasuhiro Morikawa/ULVAC, Inc.

【S12】Fusion Interconnect of Electrical and Optical for Energy Efficiency (ASE) 504 b, TaiNEX 1 10:10 - 12:10 CP Hung/ASE, Alex Wang/ASE

【S13】Heterogeneous Integration 504 c, TaiNEX 1 10:10 - 12:10 Shin-Puu Jeng/Applied Materials, Kathy Yan/TSMC

【S14】Thermal-mechanical Modeling & Simulation II 503, TaiNEX 1 10:10 - 12:10 Ming-Yi Tsai/CGU, Sheng-Jye Hwang/NCKU

【S15】Power Electronics 502, TaiNEX 1 10:10 - 12:10 Chang-Chun Lee/NTHU, Chun-Kai Liu/ITRI

【S16】Bonding, Dielectric Materials and Laser-Material Interactions 501, TaiNEX 1 10:10 - 12:10 Irving Lee/Rational Precision Industry Co., Ltd., Peter Chang/MacDermid Alpha Electronics Solutions

【S17】Redefining Advanced Packaging with Glass Core Solution (Hi-CHIP) 504 a, TaiNEX 1 13:00 - 15:00 Jerry Wang/ITRI, Randy Wu/ITRI

【S18】Enhanced Energy Efficiency in AI: Advanced Packaging and PCB Technologies for Sustainable Innovation (Qnity™, DuPont Electronics) 504 b, TaiNEX 1 13:00 - 15:00 Lucy Wei and Steven Lin/Qnity™, DuPont Electronics

【S19】Deep Learning for Geometry & Mechanics Prediction 504 c, TaiNEX 1 13:00 - 15:00 Shu-Shen Yeh/Google, Cadmus Yuan/Feng Chia University

【S20】Advanced Materials, Automatic Process & Assembly 503, TaiNEX 1 13:00 - 15:00 Lewis Huang/Senju Electronic (Taiwan), Kwang-Lung Lin/National Cheng Kung University

【S21】Materials and Interfaces for Reliable Electronics 502, TaiNEX 1 13:00 - 15:00 Jimmy Hsu/ Intel, Haley Fu/iNEMI

Poster session (Packaging+PCB) TaiNEX 1, 5F 15:00 - 15:30 Hsien Chie Cheng/Feng Chia Uni, Hsiang-Chen Hsu/I-Shou Uni, John Liu/TPCA

【S22】ISMP-Reliaiblity and Thermal Management of Advanced Packages 504 a, TaiNEX 1 15:30 - 17:30 Taek-Soo Kim/KAIST, Daeil Kwon/Sungkyunkwan University

【S23】IEEE EPS-Materials and Technologies for Advanced Packaging (SPIL) 504 b, TaiNEX 1 15:30 - 17:30 Jenn-Ming Song/National Chung Hsing University, Shaw Fong Wong/Intel

【S24】Process & Manufacturing in Advanced packaging 504 c, TaiNEX 1 15:30 - 18:00 Cheng-En Ho/YZU, Rozalia Beica/Rapidus Corporation

【S25】Characterization, Testing & Inspection in Advanced Packaging 503, TaiNEX 1 15:30 - 18:00 Yu-Jung Huang/NKUST, Ming Yi Tsai/Chang Gung University

【S26】Thermal characterization & Management 502, TaiNEX 1 15:30 - 18:00 Chien-Yuh Yang/NCU, Ben-Je Lwo/National Defense University

【S27】Smart Manufacturing and System Modeling 501, TaiNEX 1 15:30 - 18:00 Takeyasu SAITO/Osaka Metropolitan University, SJ Wu/I-Shou University

Plenary Speech V: Reimagining Advanced Packaging with Glass: Opportunities and Challenges. Sung Jin Kim, Ph.D/Absolics 504 bc, TaiNEX 1 09:00 - 09:50 Shin Puu Jeng, Applied Materials

【S28】Convergence or Divergence? Panel-Level Packaging Meets Heterogeneous Integration (Lam Research) 504 b, TaiNEX 1 10:10 - 12:10 Herbert Oetzlinger/Lam Research

【S29】Manufacturing Processes in Advanced Packaging 504 c, TaiNEX 1 10:10 - 12:10 Jun Mizuno/NCKU, De-Shin Liu/National Chung Cheng University

【S30】Electrical Characterization & Simulation 503, TaiNEX 1 10:10 - 12:10 Sung-Mao Wu/NUK, Tz-Cheng Chiu/National Cheng Kung University

【S31】Interconnect & Interface Technologies for Advanced Electronic Systems 502, TaiNEX 1 10:10 - 12:10 Tetsuya Onishi/Grand Joint technology Ltd., Geli Hung/ThinFlex Corporation

【S32】Glass Packaging 504 a, TaiNEX 1 13:00 - 15:00 Tetsuya Onishi/Grand Joint Technology

【S33】3D Embedding 504 b, TaiNEX 1 13:00 - 15:00 Dr. Weita Yang /Industrial Technology Research Institute, Dr Yoshihisa Katoh/FUKUOKA-University

【S34】Materials & Processes for Advanced Packaing from Japan (JIEP) 504 c, TaiNEX 1 13:00 - 15:00 Takeyasu SAITO/Osaka Metropolitan University, Hirokazu Noma/Resonac Corporation

【S35】Scalable Modeling in Advanced Packaging 503, TaiNEX 1 13:00 - 15:00 Ching-Feng Yu/NUU, Meng-Kai Shih/NSYSU

【S36】Advanced Materials & Processing for Electronic Packaging 502, TaiNEX 1 13:00 - 15:00 Yasuhiro Morikawa/ULVAC, Kuan-Jung Chung/National Changhua University of Education

【S37】Market Trend-AI-Powered in Semiconductor Packaging (TPCA) 4F stage, TaiNEX 1 13:00 - 15:00 Albert Lan/Applied Materials

【S38】AI HW Process and Metrology : Soldering, Power, TGV and PCB / PCBA process and PCB on AI HW (SMTA) 4F stage, TaiNEX 1 15:10 - 17:00 Jeffrey Lee/SMTA Taiwan

【PDC1】3D IC and Advanced Packaging: Fundamentals, Hybrid Bonding, Innovations and Future Perspectives 504 c, TaiNEX 1 15:10 - 18:10 Lewis Huang/Senju Electronic (Taiwan)

【PDC2】Analysis of Fracture and Delamination in Microelectronic Packages 502, TaiNEX 1 15:10 - 18:10 Dr. Andreas Ostmann/Fraunhofer IZM

IMPACT Excursion- Self-funded, min. 20 pax 台北大稻埕 10:00 - 16:30