Bio:
Rozalia Beica is Field CTO Packaging Technologies at Rapidus Design Solutions, where she focuses on advanced packaging technologies, strategy and ecosystem development. With more than two decades of experience in semiconductor packaging, heterogeneous integration, and manufacturing, she has held leadership roles across the semiconductor value chain, spanning materials (Rohm and Haas Electronic Materials, Dow Chemical, DuPont, LQDX), equipment (Applied Materials, Lam Research), substrates (AT&S), device manufacturing (Maxim IC), and market intelligence (Yole Developpement). Recognized as a leading voice in advanced packaging, she is actively involved in industry collaborations, currently serving as President of the IMAPS Silicon Valley Chapter, helping drive innovation and partnerships across the global semiconductor ecosystem.
Abstract:
Advanced packaging is becoming a key enabler of next-generation semiconductor systems, complementing advances in silicon scaling and supporting the growing demands of AI, high-performance computing, and heterogeneous integration. As system complexity increases, innovations in packaging architectures, interconnects, substrate technologies, and materials are playing an increasingly important role in delivering performance, power efficiency, and scalability.
This presentation will explore key trends shaping the advanced packaging landscape, including chiplet-based architectures, advanced memory integration, larger package formats, higher interconnect densities, and the evolution of package substrates to meet future system requirements. It will also discuss the importance of ecosystem collaboration in enabling the next generation of semiconductor innovation.