Sessions Index

S14 【S14】Thermal-mechanical Modeling & Simulation II

Oct. 22, 2025 10:10 AM - 12:10 PM

Room: 503, TaiNEX 1
Session chair： Ming-Yi Tsai/CGU, Sheng-Jye Hwang/NCKU

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Co-Organizer

                   

　

　

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Co-hosting Event - TPCA Show 2026

　

　

IMPACT 2026 | 21st International Microsystems, Packaging, Assembly and Circuits Technology Conference

Venue：Grand HiLai Taipei Hotel (Oct.19) TaiNEX 2 (Oct. 20-22)

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