Advance Package solution for Silicon Photonic application
發表編號：S12-1時間：10:10 - 10:30 |
Invited Speaker
Speaker: Sr. VP, Scott Chen, ASE
Bio:
Education:
Master of National Taiwan University (NTU) Executive MBA Program B.A.of Chemical Engineering at NTU
Experience:
Sr. VP of Central Development Engineering in ASE since 2015
Staff Engineering Manager at Motorola Electronics Taiwan. (1999)
Process Engineer in Texas Instruments Taiwan.
Vice Chairman of MEMS Committee , Taiwan Semiconductor Industry Association (2013-2014)
Supplier-chain committee Chair of HiSPA ( Heterogeneously Integrated Silicon Photonics Alliance ) since 2024"
Abstract:
Advanced package by heterogeneous integration has been enable AI related application. Not only high performance computing , but also Optics connection and transmission.
CO packaging Optics (CPO) is the best solution to improve the band width and reducing power consumption. ASE's VIPack (vertical integration packaging) platform would offers the core solution of CPO.
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Advanced chiplet packages with high density interconnect for AI era
發表編號：S12-2時間：10:30 - 10:50 |
Invited Speaker
Speaker: Manager of chiplet interconnect, Akihiro Horibe, IBM
Bio:
Akihiro Horibe received his Ph.D. in Materials Science from Keio University in 1998. His early research focused on optical polymer materials for high-speed communication and display systems. He joined the IBM Display Business Unit in 1998 and has been engaged in advanced packaging technologies within the research division since 2007. He is currently a Master Inventor, Senior Research Scientist, and Manager of the Chiplet Interconnect team at IBM Research – Tokyo. His current research interests include advanced chiplet packaging technologies and co-packaged optics. He has presented 10 original papers as lead author at the ECTC Packaging Conferences and holds more than 50 granted patents as lead inventor. He also serves as Chair of the 3D Chiplet Research Working Group of the Japan Institute of Electronics Packaging (JIEP).
Abstract:
Recent advancements in chiplet packaging technologies featuring high-density interconnects for the AI era are presented. These interconnect technologies include not only electrical solutions such as RDL or silicon bridge, but also optical communication technologies, including co-packaged optics.
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Advancing Co-Packaged Optics with Multi-Fiber, Multi-Color Silicon Photonics
發表編號：S12-3時間：10:50 - 11:10 |
Invited Speaker
Speaker: Professor, Yung-Jr Hung, National Sun Yat-sen University
Bio:
Dr. Yung-Jr Hung is a Distinguished Professor in the Department of Photonics at National Sun Yat-sen University, Taiwan. He is internationally recognized for his contributions to silicon photonics, semiconductor lasers, and fiber-optic gyroscopes. Dr. Hung has published more than 160 papers, holds 17 patents, and has played a leading role in advancing Taiwan’s photonics research and industry collaboration. His achievements have been honored with numerous awards, including the National Invention and Creation Award (Gold Medal, 2025), the Future Tech Award (2023), the Da-You Wu Memorial Award (2020), and the IEEE Best Young Professional Member Award (2019).
Abstract:
This talk presents recent progress at NSYSU on multi-fiber and multi-color silicon photonics, offering scalable solutions toward next-generation co-packaged optics and high-speed optical engines.
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Meta Lens Arrays Enabling Scalable Co-Packaged Optics
發表編號：S12-4時間：11:10 - 11:30 |
Invited Speaker
Speaker: CEO, Paul Wu, AuthenX Inc.
Bio:
With over 30 years of experience in optical communication research and industrial applications, Paul Wu has served as a faculty member in the Department of Optoelectronics at National Central University and has held leadership roles in, and founded, several companies in the photonics sector. His recent focus includes the development of External Laser Source (ELS) modules for AI GPU Link in Co-Packaged Optics (CPO), Meta-Lens Arrays for CPO integration, and advanced Silicon Photonics platforms featuring meta-structures.
Abstract:
In response to the growing demand for CPO (Co-Packaged Optics) modules in AI data centers, the development of scalable optical packaging technologies has become increasingly critical. Among these, the packaging of micro-optical components—particularly those involving Photonic Integrated Circuits (PICs) and Fiber Array Units (FAUs)—plays a pivotal role.
The Meta Lens Array presents a promising solution to streamline the assembly and testing of CPO modules. It offers high-efficiency optical coupling and enables more compact system designs. This presentation will showcase simulation and experimental results related to the integration of meta lens arrays with PICs and FAUs, highlighting their potential to enhance CPO module performance and manufacturability.
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發表編號：S12-5時間：11:30 - 12:10 |
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Invited Speaker
Speaker: , Panel Discussion,
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