Sessions Index

Bio:

Shiuh-Kao Chiang has a B.Sc. degree in Materials Science and Engineering from National Tsing Hua University in Taiwan, R.O.C., a M.S. degree in Metallurgical Engineering from University of Notre Dame, a Ph.D. in Ceramic Engineering from Ohio State University, and an Executive MBA degree from Cleveland State University.

Shiuh-Kao’s past experience includes material characterization, new product and process development, R&D management and technical marketing. Shiuh-Kao holds several patents, awards, and publications in electronic material, packaging, and processing areas. He joined Prismark in February 1998.

Dr. Shiuh-Kao Chiang is responsible for the development of Prismark’s business in Asia, as well as the management of research projects and services in Japan, Taiwan, China, Korea, Singapore, and other Asian countries. Over the past twenty years, Prismark has developed business and service relationships with most of the leading electronics, semiconductor, packaging, assembly, PCB and material companies in Asia. In addition, Prismark has also extended its services to leading financial institutions to assist their investments in Asia.

Abstract:

• Analyze the surge in ABF substrate demand driven by the AI era


• Assess ABF substrate capacity expansion and supply trends


• Identify key supply chain challenges and potential bottlenecks


• Provide an outlook for the ABF substrate market

 

Bio:

Experience:

▪2002/Nov  Sales Assist. Manager

▪2004-2007 Product and Design Eng. Manager

▪2008-2015 Business Div. Director

▪2015-2019 Corp. MFG Associate VP

▪2019-2022 Business Div. VP

▪2022-now  Business Div and Product Strategy Div. SVP

 

Education

▪Ph. D. Candidate of Organic Chemistry

    / Chung Yuan Christian University

▪Master of Organo-Metallic Chemistry

    / National Taiwan Normal University

Abstract:

Transforming eco-system of AI‑Driven World

• AI computing demands are pushing packaging density to its limits
• Heterogeneous Integration is becoming the mainstream trend
• The substrate's role is evolving — from a passive carrier to an active system interconnect hub
• Demand for ABF high density & BT memory substrate are being reinforced by AI high-performance computing

Technology Turning Point in Equipment and Materials

• Material Innovation: Developing Low Dk/Df materials for high-speed transmission needs, along with low-CTE, large-panel, low-warpage, high-reliability solutions

• Equipment Bottlenecks: The extreme challenges of high accuracy exposure machine, new laser drilling for small via, high uniformity for copper plating, with highly automated inspection

• Facility Environment: Upgrading to guarantee high production yield

• Process Complexity: Ongoing yield optimization for high layer count structures (including MLC), ultra-thick panels, and fine-pitch fabrication

Substrate Ecosystem Supply Chain Challenges & foreseen Risk

 

• Current shortages: Potential supply bottlenecks in key substrate materials such as T-glass, high-quality dielectric material, drill bits, drilling machine, and high uniformity copper plating equipment
• How these bottlenecks constrain substrate makers' capacity: Enhancing the cooperation with the supply chain and securing critical resources to reduce disruption risk; evaluating alternative core materials such as ceramic/glass core

 

Bio:

Venkata Mokkapati is currently leading global Business Development & Application Engineering teams at AT&S AG based in Austria. In this current role as Director, Venkata is involved in Business development for IC substrates & Advanced Packaging, Pricing strategy, F2F customer discussions, Technology portfolio, Technology driving factors and trends, Identifying Disruptive/Alternative/Competitive technologies, Co-ordination and guidance for customer engagements and internal technical developments, Priority setting and direction for technology development needs, Troubleshooting and bridging the business. He is also an expert member for WoW (Ways of Working) and developing internal processes for Strategic marketing, Business Development & Sales processes.

Venkata has more than 18 years of experience in Semiconductor industry and is a certified ICP engineer from Delft University of Technology from where he also holds a PhD. Prior to joining the industry in 2018, Venkata has spent 12 years in academics in various universities/Institutes across Europe and Asia. Venkata also has experience in establishing and running a sole trading company on graphene and other 2D materials. Venkata has authored and co-authored more than 40 peer-review journals/conference proceedings/patents. He is also a recipient of EC-FP7 Marie Curie Co-fund fellowship.

Abstract:

IC substrates play a critical role in Advanced Packaging (AP). With increasing demand for power delivery and signal integrity, and to meet technical demands and trends, a different engineering approach is needed. IC substrates can address these challenges at substrate level, rather than at package or system level. Core architecture in IC substrates is becoming more critical to address these challenges and demands. This talk will focus on dissecting IC substrate architecture and present solutions that can address the above-mentioned challenges.

 

Bio:

Habib Hichri is Executive Vice President and Senior Fellow for Global Applications and Business Development at Ajinomoto Fine-Techno USA. Previously, he was Director of Applications Engineering at SUSS MicroTec Photonics Systems USA, providing patterning solutions for advanced semiconductor packaging. He spent 12 years at IBM’s Semiconductor R&D Center in East Fishkill, NY, as lead process integration engineer and later in management for front-end microprocessor fabrication. Habib holds over 40 U.S. patents, has authored 80+ publications, and contributed a book chapter to Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (Wiley-IEEE). He earned his Master’s and PhD in Chemical Engineering from Claude Bernard University, France, and an MBA from SUNY Buffalo. Chair of IEEE/EPS Orange County, he serves on ECTC and IMAPS committees, is an IMAPS Fellow, and sits on the IMAPS Executive Council. Since 2024, he has been a board member of iNEMI and, since 2025 of the International Semiconductor Industry Group (ISIG).

Abstract:

The rapid expansion of AI and high-performance computing has intensified the demand for advanced packaging materials capable of supporting high data traffic, fine-pitch Cu wiring, and large-scale integration. This presentation details recent advancements in Ajinomoto Build-up Film™ (ABF™) technologies designed to address the critical challenges of electrical performance, thermal stability, and mechanical reliability.

 

Bio:

Takahisa Amemiya is President & CEO and Representative Director of FICT Limited, a leading Japanese manufacturer of high-multilayer printed circuit boards, semiconductor package substrates, and advanced interconnect solutions. He assumed his current role in 2023 after serving as FICT's Chief Strategy Officer, where he led the company's growth and strategic transformation initiatives.

Abstract:

The growing demand for AI and high-performance computing is driving the need for new substrate architectures beyond the limits of conventional organic materials. This presentation introduces FICT's Glass All Layer Z Connection Structure (G-ALCS), a multilayer glass technology that improves manufacturability, reliability, and routing density while enabling scalable 3D integration. The talk will highlight its application to future glass-based chiplet packaging platforms and next-generation semiconductor systems.

 

Bio:

Dr Thomas obtained his PhD in Chemistry from the Free University of Berlin, Germany. He joined MKS Atotech in 2014 as an R&D scientist in the Electronics division, leading several product development projects in surface treatment technology. Since 2019, he has been the Global Product Manager at MKS Atotech.

Abstract: