Oral Session Poster Session Program in PDF
IMPACT-EMAP 2020 Final Program (updated on Oct 14th)
*IMPACT-EMAP committee reserves the right to modify
| Plenary | Industrial | Special | Packaging | PCB | Poster | |
| Time | Wednesday October 21 | Time | Thursday October 22 | Time | Friday October 23 |
| | Room 504abc | | Room 504ab | | Room 504ab |
| 10:00-11:20 | Joint Opening & Award Ceremony(10:00-10:30) | 09:00-09:50 | <Plenary Speech III>
Dr. CP Hung, Vice President, ASE Group
Topic:Now and Future SiP for Double HI | 09:20-10:10 | <Plenary Speech V>
Mr. David Chang, Senior Managing Consultant, IBM Taiwan
Topic: Impact of Connected Manufacturing in the New 5G Era |
|
<Plenay I>(10:30-11:20)
Dr. Marvin Liao, Vice President, TSMC
Topic: 3D Advanced Packaging Technology and Manufacturing |
|
| 11:20-12:10 | <Plenary Speech II>
Dr. John Lau, CTO, Unimicron
Topic:Heterogeneous Integration for HPC Application Driven by AI and 5G | 10:00-10:50 | <Plenary Speech IV>
Dr. Wenchi Ting, Vice President, UMC
Topic: Emergent Memory Technology at the Crossroads | 10:30-12:35 | R504a | R504b | R504c |
| 【S19】 | 【S20】 | 【S21】 |
| 11:00-12:00 | Foyer area | Heterogeneous Integration-2 | 3D Embedding | Machine Learning Application |
| 【Poster session】 (PCB&Packaging) |
| 12:00-13:10 | Lunch | 12:00-13:10 | Lunch | 12:20-13:30 | Lunch |
| 13:10-15:10 | R504a | R504b | R504c | R503 | 13:10-15:10 | R504a | R504b | R504c | R503 | R502 | |
| 【S1】 | 【S2】 | 【S3】 | 【S4】 | 【S9】 | 【S10】 | 【S11】 | 【S12】 | 【S13】 |
| HPC by Atotech | JIEP | Advanced Packaging 1 | Advanced and Green Materials and Process | AI Technology by ASE | New Materials for Next Generation by Nan ya plastic | Power Eletronic Packaging | Advanced Materials and Process | HDI Technology |
|
| 15:10-15:40 | Coffee break | 15:10-15:40 | Coffee break |
| 15:40-17:40 | 【S5】 | 【S6】 | 【S7】 | 【S8】 | 15:40-17:40 | 【S14】 | 【S15】 | 【S16】 | 【S17】 | 【S18】 |
| SiP by SPIL | Signal and Power Integrity | Warpage Characterization | Test, Quality, AOI, Inspection and Reliability | Heterogeneous Integration-1 | ICEP | Design, Modeling & Testing | Advanced Packaging 2 | Electro Deposition and Electrochemical Processing Technology |
|
| 18:00-20:00 | x | 18:00-20:00 | International Welcome Dinner
(Invited only) |