Recent advances in artificial intelligence (AI), high-performance computing (HPC), and heterogeneous integration are reshaping modern electronics. As AI moves beyond data centers to system-level deployment and practical applications, performance, power efficiency, and reliability increasingly depend on hardware integration. Advanced packaging and PCB technologies play a central role in enabling scalable and energy-efficient AI systems.

    IMPACT-IAAC 2026 adopts the theme “Energy-Efficient AI: From Computing to Systems and Applications.” The conference focuses on key enabling technologies in electronic packaging and PCB, addressing innovations that bridge device-level performance with system-level integration and practical implementation. Topics include advanced packaging, heterogeneous integration, IC substrates, high-speed/high-frequency PCB, thermal management, reliability, manufacturing processes, materials, and sustainability.

    IMPACT-IAAC 2026 provides an international platform for researchers and engineers to present and discuss original technical contributions in advanced electronic systems. Researchers and practitioners are invited to submit their latest work and share developments with the international community.

【Date】Oct. 19^th (Mon.)-22^nd (Thur.), 2026

【Venue】Grand Hilai Taipei (Oct.19) Taipei Nangang Exhibition Center (Oct.20-22)

【Theme】Energy-Efficient AI: From Computing to Systems and Applications

【Organizer】IEEE-EPS、iMAPS Taiwan、ITRI、TPCA

【Program Features】Plenary speech、Industrial session、Special session、Invited talks、PDC

【Co-located Exhibitions】TPCA Show, TAITRONICS, AIoT Taiwan