All speaker
Yih-Lin Cheng
Acting Dean
Industry-Academia Innovation College, NTUST
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DEEPAK Kulkarni
USA
Senior Fellow
AMD
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Yu Hua Chen
Vice President
Unimicron Technology Corp.
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Naresh Kumar Asokan
Mgr. Product Marketing
Applied Materials
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Jang Fung Chen
VP
Applied Materials
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Bernhard Mueller
Sr Dir R&D
Applied Materials
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Cooper Li
TW
Platform Application Engineer
AMD
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Katie Tsai
TW
Signal Integrity engineer
AMD
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Jun Wei Chan
MAS
Signal Integrity engineer
AMD
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Aik Hong Tan
MAS
Signal Integrity engineer
AMD
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Andrew Yeoh
TW
Director
CPI and Specialty Division, Taiwan Semiconductor Manufacturing Company
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Shin Puu Jeng
SGP
Vice President
Applied Materials Singapore Technology Pte. Ltd.
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Chieh Ju Li
TW
R&D Chemist
R&D, Qnity™, DuPont Electronics
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Michael Chang
TW
Business Development Consultant
Advanced Flex Technologies, Qnity™, DuPont Electronics
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Raja Swaminathan
USA
Corporate Vice President
AMD
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Dennis (Tiang-Hao) Lin
TW
Kinsus Interconnect Technology Corp.
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CP Hung
TW
VP Corporate R&D
ASE
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Ander Hsieh
TW
Deputy Executive Director, Global Advanced Manufacturing
Wistron
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Alex Liu
TW
Technology Development Director
Raytek Semiconductor Inc.
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Jeng Ting Li
TW
Deputy Project Manager
Unimicron Technology Corp.
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Wen Liang Yeh
TW
Manager
Unimicron Technology Corp.
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Gerry Juan
TW
Tech Lead
Intel
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Jay Wu
TW
Tech Lead
Intel
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Thonas Su
TW
Tech Lead
Intel
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Bryant Tsai
TW
Staff Engineer
Intel
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Ryan Chang
TW
Staff Engineer
Intel
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Daniel Ng
TW
Technical lead and AMD fellow
AMD
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Bora Baloglu
USA
Director
Intel
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Venkata Mokkapati
AUS
Director Business Development
AT&S
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Christian Ohde
GN
General Manager
MKS' Atotech
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Kuldip Johal
USA
CTO
MKS' Atotech
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Jenn Ming Song
TW
Professor
National Chung Hsing University
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Hirokazu Ito
JPN
Manager
JSR
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Chuan Seng Tan
SGN
Professor
Nanyang Technological University
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Herbert Oetzlinger
Austira
VP
Lam Research
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Steven Tam
Japan
Product Director, IC Substrate line of business at ESI
MacDermid Alpha
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Ryo Tanaka
JPN
Section Assistant Manager Research, Electronics
Okuno chemical Industries Co., Ltd.
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Chin-Hock Toh
Singapore
SG APCO Technologist
Lam Research
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Panel Discssion (hosted by Daniel and Eddy)
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Devan ( Mahadevan) Iyer
Chief Strategist, Advanced Electronic Packaging
Global Electronics Association
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Lucy Wei
Metallization Segment Leader
Qnity™, DuPont Electronics
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Steven Lin
Global Marketing Leader, Advanced Packaging Metallization
Qnity™, DuPont Electronics
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Kuan-Neng Chen
TW
Dean/Chair professor
NYCU
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Andrew Tay
SG
Professor
NUS
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Frank J. C. Lee
USA
Vice President
TSMC
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Babak Sabi
USA
Vice President
AWS
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Jatin Upadhyay
USA
Vice President
Intel
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Takao Iwaki, Ph.D.
Japan
Director, SoC R&D Div.
MIRISE Technologies Corporation
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Sung Jin Kim, Ph.D.
KOR
CTO
Absolics
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Chi-Chuan Wang
TW
Chair professor
NYCU
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Jimmy Hsu
TW
Pricipal engineer
Intel
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Shun Mitarai
JPN
Senior Process Manager
Sony Semiconductor Solutions Corporation
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Takato Katahira
JPN
IJS Business Development Manager
Elephantech
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Teng-Kuei Chen
TW
Founder & General Manager
Wafer Chem
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Chieh-Sen Lee
TW
Assistant Manager
Elite Material Co
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Chong Leong Gan
Director
Micron
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Takashi Matsumoto
JPN
Project Director
Denso
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Shaw Fong Wong
MY
Engineering Manager
Intel
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Sam Dharmarathna
USA
R&D Business Partner -IC substrates
Macdermidalpha Electronics solutions
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Andreas Ostmann
DE
Group Manager
Fraunhofer IZM
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Chih Chen
TW
Chair Professor
NYCU
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Li-Cheng Shen
TW
Associate Vice President
USI
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De-Shin Liu
TW
Professor
National Chung Cheng University
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Takeshi Momose
JPN
Professor
Kumamoto University
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Cadmus Yuan
TW
Professor
Feng Chia University
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Takuma Nakagawa
JPN
Researcher
Mitsubishi Materials Corporation
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Ukyo Suzuki
JPN
Scientist
Kao Corporation
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Kejun Wu
JPN
Engineer
Ushio Inc
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Reito Kobayashi
JPN
Member
JCU Corporation
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Masafumi Wakai
JPN
Assistant Manager
ULVAC, Inc.
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Kathy Yan
USA
Director
TSMC
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Jan Vardaman
USA
President
TechSearch International
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Suresh Ramalingam
USA
VP, Disruptive Packaging Platforms
Applied Materials
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Terrence Tan
Malaysian
Senior Director
Microsoft
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Mr. Bassam Abdel-Dayem
USA
AWS
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Kazuhiro Nogita
Japan
Professor
The University of Queensland
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Yukako Ikegami
JPN
Senior manager
Sony Semiconductor Solutions Corporation
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Takumi Yumoto
JPN
Engineer
SHINKO ELECTRIC INDUSTRIES CO, LTD
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Joon Sang Kang
KOR
Assistant Professor
KAIST
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Tae-Ik Lee
KOR
Principal Researcher
KITECH (Korea Institute of Industrial Technology)
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Hanwool Yeon
KOR
Assistant Professor
GIST
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Seung-Kyun Kang
KOR
Professor
Seoul National University
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Eun-Ho Lee
KOR
Associate Professor
Sungkyunkwan University
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Tetsuya Onishi
JPN
Managing Director
Grand Joint Technology
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Frank Su
TW
Sr. Director
Lam Research
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Christian Buchner
DE
Vice President
SCHMID
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Jyh-Long Jeng
TW
Manager
Industrial Technology Research Institute
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Masahiro Saito
JPN
Manager
Toray Research Center, Inc.
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Jun Mizuno
JPN
Professor
National Cheng Kung University
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Masaomi Suzuki
JPN
Manager of Asia Business Unit
Zuken Inc.
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Yoshihisa Katoh
JPN
Guest Professor
Fukuoka University
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Hidenori Abe
JPN
CTO for semiconductor materials
Resonac
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Rocky L. Uriankhai
CEO
SciTech Power Research Ltd.
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Yoshihisa Kagawa
JPN
General Manager
Sony Semiconductor Solutions Corporation
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M.Bilal HACHEMI
DZ
Market and Technology Analyst - Advanced Packaging
Yole
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Ning Cheng Lee
USA
CEO
ShinePure Hi-Tech
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Charles Lin
TW
CEO
Bridge Semiconductor
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Jeffrey Lee
TW
Assistant Vice President
Integrated Service Technology Inc.
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James Chien
TW
General Manager
Taiwan ForeSight Co.Ltd
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Albert Lan
Global Sr. Packaging Account TD Head
Applied Materials
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Toshiyuki Takasaki
JPN
Manager
Panasonic Connect Co., Ltd,
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Kai Takeuchi
Assistant Professor
Tohoku University
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Vincent DiCaprio
Vice President
Applied Materials
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Scott Chen
TW
Sr. VP
ASE
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Akihiro Horibe
JPN
Manager of chiplet interconnect
IBM
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Yung-Jr Hung
TW
Professor
National Sun Yat-sen University
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Paul Wu
TW
CEO
AuthenX Inc.
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Panel Discussion
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Takashi Tasaki
JPN
Deputy General Manager
ARAKAWA CHEMICAL INDUSTRIES, LTD.
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Organizer
Co-Organizer
                 
       
Partner
           
Co-hosting Event - TPCA Show 2025