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All speaker
H.-S. Philip Wong
USA
Willard R. and Inez Kerr Bell Professor
Stanford University
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C.P. Hung
Taiwan
Vice President of Corporate R&D
ASE Group
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Rahul Manepalli
USA
Vice President
Intel Corporation
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Yashushi Araki
Japan
Corporate Officer, GM of R&D Div.
SHINKO ELECTRIC INDUSTRIES CO., LTD.
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Jeffrey C. Suhling
USA
Quina Distinguished Professor/ President
Auburn University / IEEE-EPS
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Heng Chuan Shu
Malaysia
Senior Member of Technical Staff
Advanced Micro Devices, Inc.
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John H. Lau
USA
Senior Special Project Assistant
Unimicrom
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Ning-Cheng Lee
USA
Founder
ShinePure Hi-Tech
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Gerry Juan
Taiwan
Senior Systems and Hardware Enablement Architect
Intel
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Jay Wu
Taiwan
Tech Lead
Intel
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Shih-Kang Lin
Taiwan
Distinguished Professor
National Cheng Kung University
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Kevin Liang
Taiwan
Sr. Power Engineer
Intel
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Venkata Mokkapati
Austria
Director, Business Development & Application Engineering
AT&S
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Thonas Su
Taiwan
Tech Lead
Intel
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Antony Lee
Taiwan
SVP
Kinsus
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Chiew Yee Ho, Robert Chen
Taiwan
Tech Lead
Intel
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Takahisa Amemiya
Japan
President & CEO
FICT Limited
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Green Chen
Taiwan
HW Engineer
Intel
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Joungphil Lee
Korea
Principal Engineer, Techncial Leader
Samsung Electronics
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Sotetsu Saito
Japan
R&D Engineer
Sony Semiconductor Solutions Corporation
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Tim Lin
Taiwan
Lab Innovation Lead for Electroplating
R&D, Qnity
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Jun Yoshiike
Japan
Shinko Electric Industries co., LTD
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Hiroto Sasaki
Japan
R&D Engineer
ULVAC, Inc
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Andrew Kang
Taiwan
Director
SPIL
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Kohei Horiuchi
Japan
Senior Manager
AGC
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Ming-shih Yeh
Taiwan
Deputy Director
MediaTek
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Hitoshi Araki
Japan
Senior Research Manager
TORAY INDUSTRIES, INC.
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Wilson Chang
Taiwan
Technical Service Manager
ZDT – LIST
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Gabriela Pereira
Portugal
Senior Technology & Market Analyst – Semiconductor Packaging
Yole Group
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Matt Kelly
Canada
CTO, VP Technology Solutions
Global Electronics Association
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Ming-Che (MC) Hsieh
Taiwan
Director, Technology Marketing Division
STATS ChipPAC Management Pte. Ltd.
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Jason Wang
Taiwan
Vice CTO
Unimicron
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Ander Hsieh
Taiwan
Deputy Executive Director of Advanced Process Technology & Material Characterization
Wistron
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Yujiro Hayashi
Japan
Team Leader
RIKEN Spring-8 Center
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Takashi Ito
Japan
Specialist
Toshiba Corporation
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Masao Tomikawa
Japan
Senior Fellow
Toray Industries Inc.
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Atsushi Nakamura
Japan
General Manager
JX Advanced Metals
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Harutoshi Hagino
Japan
Fujikura Ltd.
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Eiji Higurashi
Japan
Professor
Tohoku University
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Ricky Shi-Wei Lee
Hong Kong
Chair Professor
HKUST
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Li-Cheng Shen
Taiwan
AVP
USI
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Thom Gregorich
USA
Senior Director
Zeiss Semiconductor
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Shinya Shimizu
Japan
CEO & Founder
Elephantech Inc
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Chien-Yuh Yang
Taiwan
Professor
National Central University
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Cooper Li
Taiwan
Data Center Solutions Group Platform Application Engineer
Advanced Micro Devices, Inc.
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Tz-Ying Chen
Taiwan
Server Solution Group Platform Application Engineer
Advanced Micro Devices, Inc.
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Hui Hui Chan
Malaysia
Signal Integrity Engineer
Advanced Micro Devices, Inc.
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Aieman AbdulNasir
Malaysia
Signal Integrity Engineer
Advanced Micro Devices, Inc.
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Jun Wei Chan
Malaysia
Signal Integrity Engineer
Advanced Micro Devices, Inc.
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Joichi Nishimura
Japan
General Manager
SCREEN Finetech Solutions
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E. Jan Vardaman
USA
President
TechSearch International
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Scott Chen
Taiwan
Senior Vice President
ASE Inc.
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Rozalia Beica
USA
Field CTO Packaging Technology
Rapidus Design Solutions
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Dr. Martin Letz
Europe
senior princial scientist
SCHOTT AG
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Monita Pau
Onto Innovation
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Frank Bruening
Europe
General Manager BU PTH/STT
MKS' Atotech
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Deepak Kulkarni
U.S.A.
Senior Fellow, DC Architecture/Optics
AMD
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George Lin
Taiwan
Senior Director of Advanced Package Business Division Group I
Innolux
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Sarah Wozny
U.S.A.
Sr Director, Panel Technology Enablement group, Applied Materials
Applied Materials
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Pei-Ting Chou
Taiwan
Division Director
Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute
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Lucy Wei
Senior Director, Global Metallization Segment
Advanced Circuit & Packaging, Qnity
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Tim Tsai
Taiwan Sales Leader & Landed Taiwan Operation
Advanced Circuit & Packaging, Qnity
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Jake Joo
USA
Global Technology Director
Advanced Flex Technologies, Qnity
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Hidenori Abe
Japan
CTO for semiconductor materials,Executive director
Resonac Corporation
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Falconee Lee
Taiwan
Engineering Manager
Intel
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Takashi Tasaki
Japan
Deputy General Manager
ARAKAWA CHEMICAL INDUSTRIES, LTD.
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Udo Welzel
Germany
Senior Manager
Robert Bosch GmbH
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Sung-Uk Zhang
Korea
Associate Professor
Dong-Eui University
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Hyunkuk Cho
Korea
Team Leader
Tomocube
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Jonas Discher
Germany
Head of Sales
PLANOPTIK AG
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Jae Yong Song
Korea
Professor
POSTECH
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Kwangjoo Lee
Korea
Research Fellow
LG CHEM
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Jungwan Cho
Korea
Associate Professor
Sungkyunkwan University (SKKU)
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Seong Su Kim
Korea
Professor
KAIST
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Reito Kobayashi
Japan
Engineer
JCU CORPORATION
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Yingxin Goh
Malaysia
Senior Lecturer
Universiti Malaya
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Chieh-Sen Lee
Taiwan
Assistant Manager
Elite Material
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Shiuh-Kao Chiang
USA
Managing Partner
Prismark
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Habib Hichri
USA
EVP, Senior Fellow
Ajinomoto Fine Techno USA Corporation
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Richard Graf
USA
Distinguished Engineer
Marvell
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Jimmy Hsu
Taiwan
Pricipal engineer
Intel
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Andreas Ostmann
Germany
Department Head
Fraunhofer IZM
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Gang Duan
USA
SEMCO
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Rechan Fan
Taiwan
Sr. Engineer
Lenovo
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Terrence Tan
Malaysia
Senior Director
Microsoft
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Bassam Abdel-Dayem
USA
Principal Engineer
AWS
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Alex Liu
Taiwan
Technology Development Director
Raytek Semiconductor Inc.
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Yu-Hua Chen
Taiwan
Research Consultant
Industrial Technology Research Institute
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Terry Wang
Taiwan
Manager
Industrial Technology Research Institute
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Gamal Refai-Ahmed
USA
Senior Fellow and Chief Thermo-Mechanical Architect
AMD
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Jeff Arasmith
USA
Director, Corporate Marketing and Business Development
MPI Corporation
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Teddy Huang
Taiwan
Senior Manager
AUO Corporation
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Shripad Gokhale
Senior Principal Engineer
Intel
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Joey Huang
Taiwan
Manager
ASE
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James Wu
Team Lead, Thermal Mechanical Engineer
CoolIT, An Ecolab Company
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Thomas Thomas
Indonesia
Global Product Manager
MKS Atotech
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Monika Huang
Taiwan
Department Manager
Kashiyama Taiwan, Co., Ltd.
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S.P.Chung
Taiwan
General Manager
Unitech Printed Circuit Board Corp.
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Lennon Lee
Singapore
CEO
Paeonia Innovations
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Organizer
Co-Organizer
Partner
Co-hosting Event - TPCA Show 2026