Topic: Glass Packaging and Co-Packaged Optics with Silicon Photonics

Outline

Co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate chiplets such as the switch, photonic ICs (PIC) such as the laser and photodiode and the electronic ICs (EIC) such as the laser driver and transimpedance amplifier. The advantages of CPO are: (a) to reduce the length of the electrical interface between the PIC/EIC and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. Glass packaging is another important technology for high-performance computing (HPC) and data centers in artificial intelligence (AI) era. In the next few years, we will see more implementations of a higher level of heterogeneous integration of switch, EIC and PIC with silicon photonics and glass packaging, whether it is for performance, form factor, bandwidth, power consumption or cost. The contents of this lecture are shown below.

 Introduction

• Data Centers, PIC and EIC
• OBO (on-board optics), NPO (near-board optics), CPO (co-packaged optics)
• 3D Integration of PIC and EIC with µbump and Hybrid Bonding
• 3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges
• 3D Heterogeneous Integration of ASIC Switch, EIC and PIC with Glass Substrate/Interposer
• CPO with Silicon/Glass Photonics
• Process Flow of Silicon Waveguides
• Coupler between Laser and Silicon Waveguide
• Coupler between Laser and Single Mode Fiber
• Glass Packaging
• Glass Substrate vs. Glass Interposer
• TGV and RDLs
• Panel-Level Packaging
• Status of Panel Size
• Effect of Glass Substrate on PCB Solder Joint Reliability
• Summary and Recommendations

Topic: Cu-Cu Hybrid Bonding for Chiplets Heterogeneous Integration

Abstract

Cu-Cu hybrid bonding is one of the flip-chip Bumpless assembly technologies. The advantages of hybrid bonding are: (a) higher density, (b) finer pad pitch, (c) lower profile, and (d) better performance. In this lecture, some fundamentals and more than 21 high-volume manufacturing (HVM) or to be in HVM products and 12 new applications using hybrid bonding will be presented. In the next few years, we will see more implementations of Cu-Cu hybrid bonding, whether it is for performance, form factor, power consumption or cost. The content of this lecture is shown below.

Introduction

• Origin of Hybrid Bonding
• Cu-Cu Hybrid Bonding Fundamentals
• 21 HVM or to be in HVM Products with Hybrid Bonding
• 12 New Applications with Hybrid Bonding
• Summary
• Potential R&D Topics in Hybrid Bonding