| Time | Monday, October 19 | Time | Tuesday, October 20 | Time | Wednesday, October 21 | Time | Thursday Oct. 22 |
| Room | Grand Hilai Taipei 3F, Platinum Grand Ballroom B | Room | 701A, 7F, TaiNex 2 | | Room | 701A, 7F, TaiNex 2 | | Room | TaiNex 1
402bc | TaiNex 1
403 | Excursion
Tour |
| 9:30-9:50 | Opening & Award Ceremony | 9:00-9:50 | <Plenary Speech IV>
Dr. Rahul Manepalli
Fellow, Vice President of Advanced Pacakging
Intel | 9:00-9:50 | <Plenary Speech V>
Jeffrey C. Suhling,
Quina Distinguished Professor/ President
Auburn University / IEEE-EPS | 10:00-12:00 | PDC
Dr. John Lau | PDC
Ning-Cheng Lee |
| 9:50-10:40 | <Plenary Speech I>
Dr. Philip Wong
Willard R. and Inez Kerr Bell Professor
Stanford University | 10:00-10:10 | Break Time | 10:00-10:10 | Break Time |
| 10:10-12:10 | 701A | 701B | 701F | 701G | 701H | 702 | 703 | 10:10-12:10 | 701A | 701B | 701F | 701G | 701H | 702 | 703 |
| 10:40-11:30 | <Plenary Speech II>
Dr. C.P. Hung
Vice President of Corporate R&D
ASE Group | 【S2】
Enable Energy Efficient AI Technologies Through Integrated Material Solutions
(Qnity) | 【S3】
Compute & Enterprise AI(AMD) | 【S4】
Advanced Packaging ～ Hybrid bonding, Glass core, Fine RDL ～
(ICEP) | 【S5】
Signal, Power and RF Integrity | 【S6】
Advanced Testing and High-Speed Characterization | 【S7】
Advanced Interconnect Technologies | 【S8】
Advanced Package Design and Performance | 【S23】Advanced Package in AI Era (ASE) | 【S24】
Building the AI Packaging Ecosystem Innovations in Research, Materials, Equipment & Manufacturing
(Lam Research) | 【S25】
Glass Technologies for Advanced Packaging | 【S26】
Power Electronics Packaging | | 【S27】
Interconnection Materials and Assembly | 【S28】
High-Speed AI and Data Center PCB Technology |
| 11:30-13:30 | Lunch Break / Lunch talk by Delta Air Lines | 12:10-13:00 | Lunch Break / Lunch talk by Resonac @ 701A | 12:10-13:00 | Lunch Break / Lunch talk by Paeonia @ 701A | Break |
| Room | Grand Hilai Taipei 3F | Room | 701A | 701B | 701F | 701G | 701H | 702 | 703 | TPCA Show
Main Stage | Room | 701A | 701B | 701F | 701G | 701H | 702 | 703 | | 13:00-14:00 | TPCA Show
Main Stage |
| 13:30-14:20 | <Plenary Speech III>
Mr. Yashushi Araki
Corporate Officer, GM of R&D Div.
Shinko Electric Ind. Co., Ltd. | 13:00-15:00 | 【S9】
Glass substrate | 【S10】
Advancements in Component to System Integration
(GEA) | 【S11】
Architecting the Future: AI‑Driven Data Center Systems
(intel) | 【S12】
Advanced RDL and Fout-Out Technologies for Next-Generation Packaging | 【S13】
AI-Driven Advanced Packaging | 【S14】
Advanced Bonding Technologies | 【S15】
Copper Metallization and Surface Finishing | <Open Seminar I>
14:00-16:00
SiPh/CPO Heterogeneous Integration in the AI Era: CoPoS × TGV | 13:00-15:00 | 【S29】
Heterogeneous Integration in Advanced Packaging
(SPIL) | 【S30】
Advanced Glass and Interposer Technologies for Heterogeneous Integration(Hi-CHIP) | 【S31】
Advanced Packaging Process Technologies | 【S32】
Package Mechanics and Reliability | 【S33】
Design, Modeling and Simulation | 【S34】
Thermal Characterization and Management | 【S35】
Advanced Substrate and Packaging Materials | <Open Seminar III>
IEEE Distinguished Lecure
Dr. John Lau |
| 14:20-14:40 | Coffee Break |
| 14:40-17:40 | 【S1】
IAAC (IMAPS All Asia Conference) - Substrate Ecosystem and Growth: Scaling ABF, Glass, and High-Density IC Substrates for an AI‑Driven World | 15:00-15:50 | Poster session I /Coffee Break @ 701E | 15:00-15:50 | Poster session II /Coffee Break @ 701E | TPCA Show
Main Stage | |
| 15:50-17:50 | 【S16】
Next-Generation AI Server & Advanced Liquid Cooling (TTMA) | 【S17】
Surround the Glass-Advanced Packaging transition to Glass Core Substrate
(MKS' Atotech) | 【S18】
Thinking Big: How Panel-Level Packaging Is Reshaping Heterogeneous Integration
(Applied Materials) | 【S19】
Hybrid Bonding for 3D Integration | 【S20】
Design, Test and Reliability | 【S21】
Advanced Materials and Assembly Technologies | 【S22】
Sustainable Electronics and Emerging Technologies | 15:50-17:50 | 【S36】
Heterogeneous Integration | 【S37】
Thermal Management and Materials for Advanced Semiconductor Packaging(ISMP) | 【S38】
Addressing high power consuming systems: Materials & processes research in Japan
(JIEP) | 【S39】
Advanced Packaging Manufacturing & Processing | 【S40】
Modeling and Reliability of Advanced Packaging | 【S41】
Digital Engineering and Process Modeling | 【S42】
Smart Manufacturing, Inspection and Testing | <Open Seminar II>
15:00-17:00
Large form factor assembly |
| |