| Time | Tuesday October 21 |
| Room | Grand Hilai Taipei 3F, Platinum Grand Ballroom B |
| 9:30-9:40 | Opening & Award Ceremony |
| 9:40-10:30 | <Plenary Speech I> Enabling energy-efficient AI with Semiconductor Innovations.
Frank J.C. Lee, Ph.D, VP, TSMC |
| 10:30-11:20 | <Plenary Speech II> Future Packaging/System Challenges for AI Data Centers.
Babak Sabi,Ph.D,VP of Technology, Annapurna Lab, AWS |
| 11:20-12:10 | <Plenary Speech III> Architecting the Future: Innovations in Scalable Data Center Design.
Jatin Upadhyay, VP, Intel |
| | Lunch Break/ back to Hall I |
| Room | 504a | 504b | 504c | 503 | 502 |
| 13:00-15:00 | 【S1】Strategic Breakthroughs in High-Density Server Design: Elevating Compatibility and Performance (Intel) | 【S2】Enabling AI and HPC: Technology Inflections Across Advanced Packaging and Interconnect (MKS 'Atotech) | 【S3】Component to System-Level Integration (GEA) | 【S4】Cu-Cu & Hybrid Bonding | 【S5】Advanced Characterization & Materials Behavior in Electronic Packaging |
| 15:00-15:30 | Poster session I (Packaging) |
| Room | 504a | 504b | 504c | 503 | 502 |
| 15:30-17:45 | 【S6】AMD Server Solution Customer SI+EV Enablement (AMD) | 【S7】AI Packaging Supply Chain Ecosystem & Driving Technology (Applied Materials) | 【S8】Thermal-Mechanical Modeling & Simulation I | 【S9】Interconnections & Nanotechnology【S9Interconnections & Nanotechnology | 【S10】Metallization & Advanced Substrate Process Integration |
| 18:00-20:30 | IMPACT 20th Anniversary Welcome Dinner (Invited Only) |