Invited Speakers
Babak Sabi
Current Position
Vice President
Organization
AWS
Plenary Speech

Topic: Future Packaging/System Challenges for AI Data Centers

Abstract

Topic:

Abstract

Paper file
Biography

Dr. Babak Sabi is VP of Technology at AWS/Annapurna Lab. Babak joined AWS in 2024 after 40 years in Intel. Babak was Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development. During Babak’s tenure in ATTD 2.5D and 3D Advanced Packages were developed and ramp to high Volume Manufacturing. Additionally ATTD team made many advancement in Substrate and Test Technology.
Prior to leading ATTD, Babak oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.
Babak joined Intel in 1984 after receiving Babak his Ph.D. in solid state electronics from Ohio State University in 1984.

Session Program 1
Plenary Speech II: Future Packaging/System Challenges for AI Data Centers. Babak Sabi/AWS

2025/10/21 10:30-11:20 @台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B)

Time

Presentation Information

10:30-11:20

Future Packaging/System Challenges for AI Data Centers

Location: 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B)
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