Sessions Index

Bio:

Jyh-Long Jeng is the Manager of the Materials and Chemistry Laboratory at Industrial Technology Institute, Taiwan. His research area focus on the development and laminate materials for PCB appications and build-up film materials semiconductor packaging applications.

Abstract:

1. Laminate materials for PCB appications.


2. Build-up film materials for semiconductor packaging applications.


3. Evaluation platform for dielectric materials

 

Bio:

Masahiro Saito, Ph.D., is the Manager of the 2nd Surface Science Laboratories at Toray Research Center, Inc., Japan. He has over 20 years of experience in surface and interface analysis, specializing in ion beam techniques such as RBS and ERDA. Dr. Saito earned his Bachelor’s degree in Electrical and Electronic Engineering from Kyoto University, focusing on high-Tc superconductivity, and later received his Ph.D. in Material and Life Science from Kyoto Institute of Technology, where he studied ion beam interactions with polymeric materials. He also served as a guest researcher at Georg-August-Universität Göttingen, Germany, developing external ion beam systems.

Abstract:

Hybrid bonding is essential for 3D semiconductor integration, but optimizing reliability requires detailed interface analysis. This study introduces a multi-technique approach using CD-XPS, STEM, SIMS, XPS, RBS, and XAFS to investigate SiO₂/Si bonded interfaces. Special sample preparation enabled precise access to buried regions. SIMS and XPS revealed hydrogen-rich zones and contamination, while STEM and XAFS clarified structural and chemical bonding states. These findings provide insights into bonding mechanisms and offer practical guidance for process optimization in wafer-to-wafer and die-to-wafer bonding, contributing to the advancement of low-temperature, high-density semiconductor packaging.

 

Bio:

1985-1988

Candela Laser Inc

1988-2002

BOSCH Corp 

2002-2022

Waseda University

Professor, Research Organization for Nano & Life Innovation

Kyushu University, Visiting Professor

Hamamatsu University School of Medicine, Visiting Professor

National Chung Hsing University, Visiting Professor

2022-Current

National Cheng Kung University Professor

Academy of Innovative Semiconductor and Sustainable Manufacturing

Abstract:

We will explain recent technological trends in COWOS-L and CPO in heterogeneous integration.
Next, we will introduce research results on thermal management using microchannels, RDL, hybrid bonding using resin, fluxless bonding, TGV, thermal management for AR glasses, and artificial intervertebral discs using semiconductor devices.

 

Bio:

• Career

       -Working in overseas business for 26 years at ZUKEN as:

       -Application Engineer

       -Project manager working with global major customers

       -Product marketing

       -Application Engineer Manager at Zuken Taiwan

        -Asia-Pacific Regional Engineering Manager at Zuken Singapore

        -Manager of Asia Business Unit at Zuken Inc. (Japan)

• Specialized field

       –Schematic & PCB design

       –Package design

       –Electro-mechanical collaborative design

Abstract:

In the near future, electrical and mechanical design will be integrated, and a design environment that smoothly links with analysis will become important. Based on this idea, I will introduce ZUKEN’s 3D design environment "Design Force".

 

Bio:

・ 2012 to 2018 he was a professor at the Institute of Microelectronics Assembling and Packaging at the Fukuoka University, Japan.

    And since 2019 he had been the guest professor at the Fukuoka University.
・He received Ph. D degree from Shizuoka University in 2011.
・He is chair of the Device Embedding Technology Committee, established by JIEP(The Japan Institute of Electronics Packaging).
・He has been working on device embedded substrates and high density wiring of Printed Wiring Board throughout his working career in      companies and university.

・ He is chairman of "The research committee of standardization for device embedded technology" in Japan.
・He is co-convener of IEC TC91 WG6.

Abstract:

I will present the International Standard activities for 3D devise embedded module at the IEC (International Electrotechnical Commission).