Sessions Index

PL2 Plenary Speech II: Future Packaging/System Challenges for AI Data Centers. Babak Sabi/AWS

Oct. 21, 2025 10:30 AM - 11:20 AM

Room: 台北漢來飯店鉑金廳B ( Grand Hilai Taipei 3F, Platinum Grand Ballroom B)
Session chair: Kathy Yan/TSMC

Future Packaging/System Challenges for AI Data Centers
發表編號:PL2-1時間:10:30 - 11:20

Invited Speaker

Speaker: Vice President, Babak Sabi, AWS


Bio:

Dr. Babak Sabi is VP of Technology at AWS/Annapurna Lab. Babak joined AWS in 2024 after 40 years in Intel. Babak was Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development. During Babak’s tenure in ATTD 2.5D and 3D Advanced Packages were developed and ramp to high Volume Manufacturing. Additionally ATTD team made many advancement in Substrate and Test Technology.
Prior to leading ATTD, Babak oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.
Babak joined Intel in 1984 after receiving Babak his Ph.D. in solid state electronics from Ohio State University in 1984.



Abstract:








 


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Co-hosting Event - TPCA Show 2025