Sessions Index

Bio:

Dr. Daniel Ng is a AMD fellow working on enabling advance package technology for AMD products. He has around 20 years of experience in various capacity in the packaging world from substrate to advanced assembly technology development. He currently leads a team to drive OSAT technology development.

Abstract:

Advanced packaging architectures are fundamental building blocks to the explosive growth of AI and HPC. In order to meet the demands of current and future AI and HPC applications, evolution in packaging technology is essential to keep pace with the demand. In addition, emphasis on the innovations and optimization of AI hardwares beyond the package will also be discussed. Product performance improvements through the various advanced packaging architectures used at AMD's range of products will be discussed highlighting the importance and benefits of continuous technology breakthrough. Lastly, new technology evolution to further advance AI and HPC applications will also be discussed.

 

Bio:

Bora Baloglu is currently the Business Development Director for Advanced Packaging at Intel Foundry, overseeing both Asia and Europe regions. He has been with Intel for the past three years. Prior to joining Intel, he spent about eleven years at Amkor Technology, where he worked in the Research and Development Department, focusing on wafer-level and panel-level packaging technologies and also in Wafer Level Business Units. During his time at Amkor, he also completed a three-year expatriate assignment in Portugal, working on the development of the Panel-Level Fan-Out platform. Bora holds over 60 issued and pending patents in semiconductor packaging field. He earned his Master’s and Ph.D. degrees from Lehigh University in Bethlehem, Pennsylvania, completing his studies in 2011.

Abstract:

Advanced packaging has become a key technology in boosting the computing performance of silicon chips, especially as traditional transistor scaling becomes increasingly difficult and expensive, particularly for high-power demanding applications like AI and Machine Learning. Primarily the heterogeneous integration and 2.5D packaging architectures have become essential, enabling greater performance and functionality by integrating multiple components within a single package. This presentation will highlight Intel’s latest advancements in packaging technologies, including EMIB (Embedded Multi-Die Interconnect Bridge), 2.5D-equivalent solution, and It will also examine the opportunities and challenges in developing the next generation of advanced packaging architectures.

 

Bio:

Venkata Mokkapati is currently Director, Business Development & Application Engineering at AT&S AG based in Austria. Venkata has more than 18 years of experience in Semiconductor industry and is a certified ICP engineer from Delft University of Technology from where he also holds a PhD. Prior to joining the industry in 2018, Venkata has spent 12 years in academics in various universities/Institutes across Europe and Asia. Venkata also has experience in establishing and running a sole trading company on graphene and other 2D materials. Venkata has authored and co-authored more than 40 peer-review journals/conference proceedings/patents. He is also a recipient of EC-FP7 Marie Curie Co-fund fellowship.

Abstract:

Advanced Packaging (AP) is further evolving as several amendments are needed with increasing technical, architectural/functional and market demands. IC substrates play an important role in interconnecting Silicon with organic world and have to follow the packaging trends. This talk focuses on the current trends, new technologies, requirements and solutions that IC substrates can offer to meet the industry demands. Large Form factors, Embedded components and UHD (Ultra High Density) substrates will be discussed in detail.

 

Bio:

Christian joined Atotech in 2010 after completing his PhD in chemistry. In 2013, he became Head of R&D for electrolytic copper plating, focusing on advanced metallization processes across various equipment platforms. Since 2020, he has served as Global Product Director and General Manager for Semiconductor, Final finishing and Functional Electronics Coatings, leading global innovation and strategy in surface finishing technologies.

Abstract:

1) Roadmap and future requirements
2) Technical features and
3) Performance highlights
4) Applications and use cases

 

Bio:

Kuldip Johal has been with Atotech for over 37 years. During this period, he has held several positions, including R&D Management, GM Product Director, North America Managing Director, and Global OEM/Pathfinding Senior Director. He is currently the MSD CTO/VP of Business Development, where he is responsible for developing the divisional-advanced packaging technology strategy, and for working with key industry influencers and supply chain enablers. He fosters a collaborative approach across business units (BUs) and regions to accelerate business growth.

Abstract:

This talk focuses on the evolution of advanced packaging and its continous drive for "more than moore"

1) Introduction artifical inteleigance changing the digital world.
2)Interconnect technologies from Silicon to PCB
3)Key technology challenges impacting IC substrate and PCB.
4) Adoption of SC manufacturing approaches and Supply chain collaborations.

5) Summary

 

Bio:

Abstract: