P1. Advanced Packaging Technologies
Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/Fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, and Other new technologies for advanced microelectronics.
P2. Power Electronics Packaging
GaN power device, SiC power MOSFET, High voltage packages, IGBT module assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) bonding, Advanced cooling system, Ceramic substrate technologies (DBC, DPC, AMB..etc), High-performance passive components, and High speed/integration power package.
P3. Heterogeneous Integration
SiP (PoP, PiP), 3D integration including Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, underfill, interposer, 3D IC applications, etc.
P4. Wearable Technologies
Flexible electronics packaging, Advanced FPC technology, ACF/ACP bonding, Thin packaging, Low-temperature bonding, MEMS sensor packages, and Any advanced packaging related to IoT (Internet of Things)
P5. Interconnections & Nanotechnology
Interconnect technologies on all packaging levels including wire bonding, flip chip, and TSV connections in first-level package, Special emphasis on design and process of solder alternatives (e.g. ICP, ACP, ACF, NCP), Under bump metallurgy, Electro-migration, Micro-bump, Substrate technology, Novel enabling techniques, Electrical performance, and Environmental concerns.
P6. Design, Modeling & Testing
Electrical, optical, and mechanical modeling, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, Analytical and advanced numerical simulation methodologies and tools, Design rule development, Virtual prototyping in product and/or process design, Micro to macro simulation, and Multi-physics simulation.
P7. Thermal Management
Thermal management materials, Two-phase heat transfer, Air cooling/liquid cooling, Emerging cooling technology, Thermal design/modeling, LED thermal management, and Thermoelectric cooling and generation.
P8. Advanced Sensor &Microsystems Technology (MST)
Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, and Sensing, actuation and control circuits on microsystems.
P9. Advanced Materials, Automatic Process & Assembly
Materials and automatic processes for 2D/3D microelectronics, MEMS, Sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes and equipment for automation, and Material characterization
P10. Emerging Systems Packaging Technologies
Renewable energy, Energy storage, Embedded passives & actives on substrates, Packaging solutions for RF-microwave, Flexible electronics, Bioelectronics, Automotive electronics, Optoelectronics, Medical Electronics, Green packaging, LED and optoelectronics packaging, and Other novel system packaging technologies.