The IMPACT 2017 conference will be held in conjunction with TPCA SHOW 2017 on Oct. 25 th -27 th at Taipei Nangang Exhibition Center. The IMPACT Conference which is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA is the largest gathering of IC packaging and PCB professionals in Taiwan. Looking farther forward to future technology trends, the Intelligent Things fall into several areas: smart application, robot, drones, autonomous vehicles, artificial intelligence and IoT devices. Each application influences a large impact in our daily life. For grasping the latest trend, the IMPACT highlights the theme “IMPACT on Intelligent Everything” and will arrange plenary speeches, special sessions, invited talks, industrial sessions, posters and outstanding paper presentations. Furthermore, IMPACT Conference keeps collaborating with international organizations such as ICEP from Japan and iNEMI from U.S.A. We hope this conference will become a remarkable platform to show your technology research and capability.
P1. Advanced Packaging Technologies
Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/Fan-out technologies, Multi-chip modules, Fine pitch/high pin packaging solution, Other new technologies for advanced microelectronics
P2. Power Electronices Packaging
GaN power device, SiC power MOSFET, High voltage packages, IGBT module assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) Bonding, Advanced cooling system, Ceramic substrate technologies (DBC, DPC, AMB..etc), High-performance passive components, High speed/integration power package
P3. 3D Integration and SiP
SiP (PoP, PiP), 3D integration including Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, unerfill, interposer, 3D IC applications, etc.
P4. Wearable Technologies
Flexible electronics packaging, Advanced FPC technology, ACF/ACP bonding, Thin packaging, Low-temperature bonding, MEMS sensor packages, any advanced packaging related to IoT (Internet of Things), etc.
P5. Interconnections & Nanotechnology
Interconnect technologies on all packaging levels including wire bonding, flip chip and TSV connections, first-level package. Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP), under bump metallurgy, electromigration, micro-bump, substrate technology, novel enabling techniques, electrical performance, environmental concerns.
P6. Modeling, Simulation & Design
Electrical, optical, and mechanical modeling, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, Advanced numerical and analytical simulation methodologies and tools, Design rule development, Virtual prototyping in product and/or process design, From micro to macro simulation, Multi-physics simulation.
P7. Thermal Management
Thermal management materials, Two-phase heat transfer, Air cooling/liquid cooling, Emerging cooling technology, Thermal design/modeling, LED thermal management, Thermoelectric cooling and generation.
P8. Advanced Sensor & Microsystems Technology(MST)
Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, Sensing, actuation and control circuits on microsystems.
P9. Advanced Materials, Automatic Process & Assembly
Materials and Automatic processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes and Equipment for Automation.
P10. Emerging Systems Packaging Technologies
Renewable Energy, Energy Storage, Embedded passives & actives on substrates, Packaging solutions for RF-Microwave, flexible electronics, bioelectronics, automotive electronics, optoelectronics and Medical Electronics, Other novel system packaging technologies, Green packaging, LED & Optoelectronics packaging.
B1. Green Materials and Process
Green (LF, HF, energy saving, recycling) material, and green process on board manufacturing (Rigid, Flex, Rigid-Flex, Substrate)
B2. Test, Quality, AOI, Inspection and Reliability
Visual inspection, Structure integrity, inspection, X-ray, AOI, electrical test, failure analysis.
B3. HDI and Embedded Technology
Lamination for Build-up board, copper plating for Microvia filling and small PTH plugging.
B4. Electro Deposition and Electrochemical Processing Technology
Electro-chemical migration, PTH, Plating and etching chemical and process.
B5. Advanced and Emerging Technology
Optical Circuit board, SMT and Module, Electroless Plating Technology, Ink-Jet printing technology, Emerging Material, equipment and assembly technolog
B6. Mechatronics and Automation
• Mechatronics, robotics, automation, control systems
• Elements, structures, mechanisms, and their applications
• Telerobotics, human computer interaction, human-robot interaction
• Control system modeling, simulation techniques, and control applications
• Intelligent control, neuro-control, fuzzy control and their applications
• Industrial process control, manufacturing process and automation (tentative)
B7. Advanced Materials
Low Dk, Low Df, Low CTE, High frequency application