Accepted Papers Will Be Submitted to  IEEE Xplore ! 

      Consumer Electronics Association(CEA) identifies the five tech trends for 2014: the Internet of Things (IoT), driverless cars, digital health care, robotics and content curation. The research report shows their potential to enrich our lives, and in some cases, massively change them. To reflect the cutting-edges technology development, the theme of IMPACT-EMAP 2014 highlights “Challenge for Change-Shaping the Future” and will arrange keynote speeches, invited talks, industrial sessions and outstanding paper presentations. The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan, attracting over 3,600 attendees in accumulated total over the past few years.

      This year, the 9th IMPACT (International Microsystems, Packaging, Assembly, Circuits Technology) Conference will be held in conjunction with the 16th EMAP (International Conference on Electronics Materials and Packaging) which just rotates to Taipei. IMPACT Conference keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U.S.A. The IMPACT Conference is an amazing convergence of microsystems knowledge and community via bridging the industries and academia. IMPACT is committed to helping you fulfill your increasingly demanding role in the R&D department, and providing more contents relevant to your needs and goals than ever before!


Date: October 22 (Wed) - October 24 (Fri), 2014

Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan

Conference: IMPACT-EMAP 2014 Joint Conference

Exhibition : TPCA Show 2014

Theme: Challenges of Change - Shaping the Future


Plenary Speaker    See for more

Dr. Tien Wu (COO, ASE)
Dr. Jie Xue (
President, IEEE-CPMT / Senior Director, CISCO)
Dr. Mike Ma (VP, SPIL)
Shuzo Akejima (Senior Fellow, Toshiba S&S Company)
Chee Kien Lim (
VP, Asia, STATS ChipPAC)


Invited Speaker 

>> See for more  (Check all the list)

[S1] Advance Package & 2.5D/3D IC

See for more  (1330-1530, October 22, 2014)  by SPIL

[S2] The Challenges of New Application for Laminate Materials

See for more  (1330-1530, October 22, 2014)  by Nan Ya Plastics

[S3] SiP Integrating Package and System

See for more  (1545-1745, October 22, 2014)  by ASE

[S5] ICEP Japan Session

See for more  (1030-1230, October 23, 2014)

[S10] IEEE-CPMT SiP: From tech to biz

See for more  (1430-1600, October 23, 2014)

[S11] Meet Korea Session

See for more  (1430-1730, October 23, 2014)

[S15] Panel Discussion on Interposer
See for more  (1615-1745, October 23, 2014)

[S16] iNEMI- Roadmap 2015 Session

See for more  (1030-1230, October 24, 2014)







For questions on paper submission, please contact:


Technical Program Chair


Prof.  Hsiang-Chen Hsu 徐祥禎 (ISU)


Technical Program Co-chair


Dr.  Wei-Chung Lo 駱韋仲 (ITRI)

Prof.  Hsien-Chie Cheng 鄭仙志 (FCU)


Dr. Yasumitsu Orii (IBM Japan, Ltd.)

Local Committee Chair


Prof. Yu-Jung Huang 黃有榕 (ISU)                                  


Requests for the symposia, please




Taiwan Printed Circuit Association
Tel: +886.3.381.5659 ext. 405
(Sylvia Yang)
Fax: +886.3.381.5150



IMPACT 2014 acknowledged both by IEEE and IMAPS

Review previous 2013 IMPACT proceedings <Flash Back>

  IMPACT 2015- Oct.21-23!
  Thank you for coming & Review Photos
  Agenda Change: Shangguan’s talk moves to S-4
  Final Call! Registration discount due on Oct. 9! 優惠價只到本周五
  New! Download Latest Program 下載大會手冊和議程總表


Golf Tournament

City Tour

Plant Tour
(for overseas attendees)

(Before Sep. 30)

Travel Information


Industrial Session



see full sponsors





Government Sponsor

Bureau of Foreign Trade

Photo Gallery new 
(See the Pictures)




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