Accepted Papers Will Be Submitted to  IEEE Xplore ! 

      Consumer Electronics Association(CEA) identifies the five tech trends for 2014: the Internet of Things (IoT), driverless cars, digital health care, robotics and content curation. The research report shows their potential to enrich our lives, and in some cases, massively change them. To reflect the cutting-edges technology development, the theme of IMPACT-EMAP 2014 highlights “Challenge for Change-Shaping the Future” and will arrange keynote speeches, invited talks, industrial sessions and outstanding paper presentations. The IMPACT Conference is the largest gathering of packaging and PCB professionals in Taiwan, attracting over 3,600 attendees in accumulated total over the past few years.

      This year, the 9th IMPACT (International Microsystems, Packaging, Assembly, Circuits Technology) Conference will be held in conjunction with the 16th EMAP (International Conference on Electronics Materials and Packaging) which just rotates to Taipei. IMPACT Conference keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U.S.A. The IMPACT Conference is an amazing convergence of microsystems knowledge and community via bridging the industries and academia. IMPACT is committed to helping you fulfill your increasingly demanding role in the R&D department, and providing more contents relevant to your needs and goals than ever before!

 
   

Date: October 22 (Wed) - October 24 (Fri), 2014

Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan

Conference: IMPACT-EMAP 2014 Joint Conference

Exhibition : TPCA Show 2014

Theme: Challenge for Change-Shaping the Future

 

Plenary Speaker    See for more

Dr. Tien Wu (COO, ASE)
Dr. Jie Xue (
President, IEEE-CPMT / Senior Director, CISCO)
Dr. Mike Ma (VP, SPIL)
Shuzo Akejima (Senior Fellow, Toshiba S&S Company)
Chee Kien Lim (
VP, Asia, STATS ChipPAC)

 

Invited Speaker 

See for more  (Check all the list)

ICEP Japan Session

See for more  (1030-1230, October 23, 2014)

 

IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT-Taipei)

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN (ITRI)

INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY -TAIWAN (IMAPS-Taiwan)

TAIWAN PRINTED CIRCUIT ASSOCIATION (TPCA)

 

For questions on paper submission, please contact:

 

Technical Program Chair

 

Prof.  Hsiang-Chen Hsu 徐祥禎 (ISU)

 

Technical Program Co-chair

 

Dr.  Wei-Chung Lo 駱韋仲 (ITRI)

Prof.  Hsien-Chie Cheng 鄭仙志 (FCU)

 

Dr. Yasumitsu Orii (IBM Japan, Ltd.)

Local Committee Chair

 

Prof. Yu-Jung Huang 黃有榕 (ISU)                                  

 

Requests for the symposia, please

 

 

Secretariat

Taiwan Printed Circuit Association
Tel: +886.3.381.5659 ext. 405
(Sylvia Yang)
Fax: +886.3.381.5150
Email:
service@impact.org.tw

 
 

 

IMPACT 2014 acknowledged both by IEEE and IMAPS

Review previous 2013 IMPACT proceedings <Flash Back>

  2014/8/15
  Check advance program and Full-Paper due on August 15!
  2014/8/11
  View Invited Speakers and Their sessions
  2014/7/22
  Paper Acceptance Notice Sent Already!
  2014/6/20
  Final Count down! Submit Your Abstract Before June 29
  2014/5/30
  Reveal TPC/IAB/DAB sub-committees
 

 

Golf Tournament


City Tour


Plant Tour
(for overseas attendees)

(Before Sep. 30)


Travel Information


 

Industrial Session

 

 

see full sponsors

 

 

 

 

Government Sponsor

Bureau of Foreign Trade

 
 
 

 

 

 

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