Microsystems & Packaging Technology

P1. Emerging Systems Packaging Technologies

3D integration, SiP (Planar die, Stacked die, PoP, PiP), TSV (through Silicon Via), Embedded passives & actives on substrates, Packaging solutions for flexible electronics, bioelectronics, wearable electronics, organic/printable electronics, NEMS, automotive electronics and optoelectronics, Other novel system packaging technologies. Special emphasis on 3D wafer integration including TSV process, wafer to wafer bonding, die to wafer bonding, die to die bonding and wafer thinning.

P2. Advanced Packaging Technologies

Wafer level packaging, Flip chip packaging, Chip scale packaging, Multi-chip modules, LED packaging, High voltage packages, Green electronic packaging, RF-ID, Power electronics packages, Portable power supply packaging, Flexible electronics packaging, Other new technologies for advanced microelectronics. Special emphasis on advances in flip-chip, fine pitch and high pin count packaging.

P3. Interconnections & Nanotechnology

Interconnect technologies on all packaging levels including wire bonding, flip chip, 3D and TSV connections, first-level package. Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP), under bump metallurgy, electromigration, micro-bump, substrate technology, novel enabling techniques, electrical performance, environmental concerns.

P4. Modeling, Simulation & Design

Electrical, optical, and mechanical modeling, Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis, Design of experiment, Design optimization, Advanced numerical and analytical simulation methodologies and tools, Design rule development, Virtual prototyping in product and/or process design, From micro to macro simulation, Multi-physics simulation.

P5. Thermal Management

Thermal management materials, Two-phase heat transfer, Air cooling/liquid cooling, Emerging cooling technology, Thermal design/modeling, LED thermal management, Thermoelectric cooling and generation.

P6. Advanced Sensor & Microsystems Technology (MST)

Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms, Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, Sensing, actuation and control circuits on microsystems.

P7. Advanced Materials, Process & Assembly

Materials and processes for 2D/3D microelectronics, MEMS, sensor and microsystem packaging including adhesives, encapsulants, lead free solders and alloys, Thermal interface materials, High/low-k dielectrics and substrates, Thin films, TSV drilling/etching, Plating, Low temperature bonding, Assembly processes.

Electronic Circuit (PCB) & Assembly Technology

B1. Materials and Process

Green (LF, HF, energy saving, recycling) material, and process on board manufacturing (Rigid, Flex, Rigid-Flex, Substrate)

B2. Test, Quality, Inspection and Reliability Technology

Visual inspection, Structure integrity, inspection, X-ray, AOI, electrical test, failure analysis.

B3. Build-up/HDI and Embedded Technology

Lamination for Build-up board, copper plating for Microvia filling and small PTH plugging.

B4. Electro Deposition and Electrochemical Processing Technology

Electro-chemical migration, PTH, Plating and etching chemical and process.

B5. Surface Mounting and Assembly Technology

Components, Pb free soldering, Micro-soldering, Reliability

B7. Mechatronics and Automation

• Mechatronics, robotics, automation, control systems
• Elements, structures, mechanisms, and their applications
• Telerobotics, human computer interaction, human-robot interaction
• Control system modeling, simulation techniques, and control applications
• Intelligent control, neuro-control, fuzzy control and their applications
• Industrial process control, manufacturing process and automation
(tentative)