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Best Student Paper Award & Outstanding Paper Award

Best Student Paper Award and Outstanding Paper Award will be elected by IMPACT Technical Program Committee from student and industrial papers respectively. The paper awardees will be announced and honored at the conference.

Outstanding PCB Thesis Award

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To explore Taiwan potential of research and bring about win-win results for domestic academia and PCB industry, Outstanding PCB Thesis Award will be honored and rewarded to the authors who are qualified and elected by evaluation committee of the Taiwan PCB institute. [Application Form: Download]

PCB優秀論文獎甄選辦法
2010年起，PCB優秀論文獎獨立新增機械項目獎金，歡迎從事PCB及機械PCB機械相關領域之研究之在學生參與。
二、辦法下載: 2010年PCB優秀論文獎甄選辦法
三、聯絡窗口Email: jerry@tpca.org.tw Tel: 03-3815659 #504

u IMPACT 2010 Paper Award

Outstanding Paper Award
Field	Paper Code	Paper Title	Lead Author	Company
Packaging	TW076-1	Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings	Tz-Cheng Chiu	National Cheng Kung University
	TW136-1	Development of 30um pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip COC interconnects	Jing-Ye Juang	Industrial Technology Research Institute
	EU131-1	Pure Palladium in ENEPIG Surface Finishes – Physical properties of the Pd deposition and their influence on soldering and wire bonding	Bill Kao	Atotech Berlin
PCB	TW026-1	An Approach to Develop High-Tg Epoxy Resins for Halogen-Free Copper Clad Laminates	Ching-Hsuan Lin	National Chung Hsing University
PCB	EU024-1	Advantage of Non-Etching Adhesion Promoter on High Frequency Signal Loss	Roger Massey	Atotech Deutschland GmbH

Best Student Paper Award
Field	Paper Code	Paper Title	Lead Author	Company
Packaging	TW082-1	Novel integrated ground resonators for slot-crossing differential line to reduce GHz common-mode radiation in advanced PCB	Hao-Hsiang Chuang	National Taiwan University
Packaging	TW168-1	Molecular Dynamics Calculations and Nanoindentation Testing of the Strain-rate and Size Dependent Material Properties of Cu3Sn IMC	Ching-Feng Yu	National Tsing Hua University
PCB	TW073-1	Study of UBM Consumption in Flip Chip Solder Joints under Varied Extra-High Current Density with Local Temperature Control	Ting-Li Yang	National Taiwan University
PCB	TW002-1	Cross-Interaction between Ni and Cu across a High-Lead Solder Joint with Different Solder Volume	Chih-Chiang Chang	National Taiwan University

Best Poster Paper Award
Field	Paper Code	Paper Title	Lead Author	Company
Packaging	TW177-1	Structure and Method of Forming Pillar Bumps with Controllable	Hou-Jun Hsu	National Taipei University of Technology
Packaging	TW182-1	Characteristic Analysis of Multi-layer Piezoelectric Substrate for SAW Filters by Effective Surface Permittivity Method	Shao-Wei Luo	National Tsing Hua University
PCB	TW110-2	Influence of Trace Geometry on the Current Crowding Effect in Ultra-Fine Pitch Micro-Bump	Yuan-wei Chang	National Chiao Tung University

u IMPACT 2010 First and Farthest Prizes

Special Prize	Reg No / Paper Code	Participant	Affiliation	Nationality
First Author	TW002-1	Chih-Chiang Hsu	National Taiwan University	Taiwan
First Attendee	A000057009	Chih-Chiang Chang	National Taiwan University	Taiwan
Farthest Attendee	A000057044	Paul Collander	Poltronic Ltd.	Finland

u Outstanding PCB Thesis Awards 2010

PRIZE	PAPER CODE	TOPIC	AUTHOR	PROFESSOR	SCHOOL
Gold	TW079-1	A Study on the Soldering Reaction between Sn3Ag0.5Cu and Electrolytic-Ni Coated with A Au/Pd(P) Bilayer Surface Finish	Wei-Hsiang Wu	C. E. Ho	Yuan Ze University
Merit	TW012-1	A Novel Copper Plating Formula for Through Silicon HolesFilling in a Center-up Mode	Chun-Wei Lu,	Wei-Ping Dow	National Chung Hsing University
Merit	TW104-1	Warpage and Curvature Determination of PCB with DIMM Socket During Reflow Process by Strain Gage Measurement	P.S. Huang	M.Y. Tsai	Chang Gung University
Merit	TW073-1	Study of UBM Consumption in Flip Chip Solder Joints under Varied Extra-High Current Density with Local Temperature Control	T. L. Yang	C. R. Kao	National Taiwan University
Merit	TW143-1	Role of Ni and Cu Metallization Dissolution in Various Ni/Solder/Cu Jointing Sequences	C. S. Liu	C. E. Ho	Yuan Ze University
Merit	TW019-1	In-Situ Reliability Monitoring on PBGA Packaging Through Piezoresistive Stress Sensor	Yu-Yao Chang,	Ben-Je Lwo	National Defense University,
Merit	TW018-1	Influence of Reducibility of Reductant on Nickel Nanoparticles Formation on Polyimide	Shang-En Huang	Wei-Ping Dow	National Chung Hsing University

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