Best Student Paper Award & Outstanding Paper Award

 

 

Best Student Paper Award and Outstanding Paper Award will be elected by IMPACT Technical Program Committee from student and industrial papers respectively. The paper awardees will be announced and honored at the conference.

 

Outstanding PCB Thesis Award

To explore Taiwan potential of research and bring about win-win results for domestic academia and PCB industry, Outstanding PCB Thesis Award will be honored and rewarded to the authors who are qualified and elected by evaluation committee of the Taiwan PCB institute. [Application Form: Download]

PCB優秀論文獎甄選辦法
2010年起,PCB優秀論文獎獨立新增機械項目獎金,歡迎從事PCB及機械PCB機械相關領域之研究之在學生參與。
二、辦法下載: 2010年PCB優秀論文獎甄選辦法
三、聯絡窗口Email: jerry@tpca.org.tw Tel: 03-3815659 #504

u IMPACT 2010 Paper Award

Outstanding Paper Award

Field

Paper Code

Paper Title

Lead Author

Company

Packaging

TW076-1

Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings

Tz-Cheng Chiu

National Cheng Kung University

TW136-1

Development of 30um pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip COC interconnects

Jing-Ye Juang

Industrial Technology Research Institute

EU131-1

Pure Palladium in ENEPIG Surface Finishes – Physical properties of the Pd deposition and their influence on soldering and wire bonding

Bill Kao

Atotech Berlin

PCB

TW026-1

An Approach to Develop High-Tg Epoxy Resins for Halogen-Free Copper Clad Laminates

Ching-Hsuan Lin

National Chung Hsing University

EU024-1

Advantage of Non-Etching Adhesion Promoter on High Frequency Signal Loss

Roger Massey

Atotech Deutschland GmbH

Best Student Paper Award

Field

Paper Code

Paper Title

Lead Author

Company

Packaging

TW082-1

Novel integrated ground resonators for slot-crossing differential line to reduce GHz common-mode radiation in advanced PCB

Hao-Hsiang Chuang

National Taiwan University

TW168-1

Molecular Dynamics Calculations and Nanoindentation Testing of the Strain-rate and Size Dependent Material Properties of Cu3Sn IMC

Ching-Feng Yu

National Tsing Hua University

PCB

TW073-1

Study of UBM Consumption in Flip Chip Solder Joints under Varied Extra-High Current Density with Local Temperature Control

Ting-Li Yang

National Taiwan University

TW002-1

Cross-Interaction between Ni and Cu across a High-Lead Solder Joint with Different Solder Volume

Chih-Chiang Chang

National Taiwan University

Best Poster Paper Award

Field

Paper Code

Paper Title

Lead Author

Company

Packaging

TW177-1

Structure and Method of Forming Pillar Bumps with Controllable

Hou-Jun  Hsu

National Taipei University of Technology

TW182-1

Characteristic Analysis of Multi-layer Piezoelectric Substrate for SAW Filters by Effective Surface Permittivity Method

Shao-Wei Luo

National Tsing Hua University

PCB

TW110-2

Influence of Trace Geometry on the Current Crowding Effect in Ultra-Fine Pitch Micro-Bump

Yuan-wei  Chang

National Chiao Tung University

 u IMPACT 2010 First and Farthest Prizes

Special Prize

Reg No / Paper Code

Participant

Affiliation

Nationality

First Author

TW002-1

Chih-Chiang Hsu

National Taiwan University

Taiwan

First Attendee

A000057009

Chih-Chiang Chang National Taiwan University Taiwan

Farthest Attendee

A000057044

Paul Collander

Poltronic Ltd.

Finland

 u Outstanding PCB Thesis Awards 2010

PRIZE

PAPER CODE

TOPIC

AUTHOR

PROFESSOR

SCHOOL

Gold

TW079-1

A Study on the Soldering Reaction between Sn3Ag0.5Cu and Electrolytic-Ni Coated with A Au/Pd(P) Bilayer Surface Finish

Wei-Hsiang Wu

C. E. Ho

Yuan Ze University

Merit

TW012-1

A Novel Copper Plating Formula for Through Silicon HolesFilling in a Center-up Mode

Chun-Wei Lu,

Wei-Ping Dow

National Chung Hsing University

Merit

TW104-1

Warpage and Curvature Determination of PCB with DIMM Socket During Reflow Process by Strain Gage Measurement

P.S. Huang

M.Y. Tsai

Chang Gung University

Merit

TW073-1

Study of UBM Consumption in Flip Chip Solder Joints under Varied Extra-High Current Density with Local Temperature Control

T. L. Yang

C. R. Kao

National Taiwan University

Merit

TW143-1

Role of Ni and Cu Metallization Dissolution in Various Ni/Solder/Cu Jointing Sequences

C. S. Liu

C. E. Ho

Yuan Ze University

Merit

TW019-1

In-Situ Reliability Monitoring on PBGA Packaging Through Piezoresistive Stress Sensor

Yu-Yao Chang,

Ben-Je Lwo

National Defense University,

Merit

TW018-1

Influence of Reducibility of Reductant on Nickel Nanoparticles Formation on Polyimide

Shang-En Huang

Wei-Ping Dow

National Chung Hsing University

 

 

 

 

 
 
Copyright © 2010 IMPACT IMPACT 2009 | Hotel Information
assembly technology