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Album
Media
Report |
| Accepted
Papers Will Be Collected in
IEEE Xplore ! |
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Taiwan, Silicon Island
acts as a crucial position among worldwide
electronic industry with high percentage
revenue on 55% of IC packaging, 61% of
testing, 70% of thermal and 25% of PCB
industry. Taiwan specially outstands on
account of its complete electronics supply
chain to keep the global competition. With
worldwide participation, the 4th
International Microsystems, Packaging,
Assembly and Circuits Technology Conference
(IMPACT 2009) will be held simultaneously
with TPCA Show at Taipei Nangang Exhibition
Hall during October 21 to 23, 2009. Original
and unpublished Papers on all aspects of
Microsystems, Electronic Packaging,
Assembly, Materials and Circuits from
worldwide will be solicited. |
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Jointly organized by
IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou
University, SMTA and TPCA, IMPACT 2009
expects the theme,
¡§IMPACT Your Future:
Integration, Efficiency, & the Eco-Friendly¡¨,
to
bring together researchers, engineers and
experts actively engaged in such a
distinguished gathering to share current
progress and exciting advanced technologies
applying in near future. IMPACT 2009 as one
of the most remarkable conferences aims at
the communication and cooperation between
academic and industrial circles to explore
the electronics¡¦ potential and bring about
win-win results for research and
manufacture. |
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IMPACT Your Future: Integration, Efficiency,
& the Eco-Friendly |
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Speaker Introdution
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Dr.
Ho-Ming, Tong (Chief R&D Officer &
General Manager of Group R&D,
ASE Group,
Taiwan)
[Link] |
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Topic: IC Packaging as a Supply Chain
Enabler & Future Trends |
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Delip Bokil (President, IMAPS, USA)
[Link] |
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Topic:
Microelectronics Packaging ¡V Design to
Manufacturing |
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Dr.
Robert C. Pfahl (VP, iNEMI Global
Operations)
[Link] |
Topic:
Thrust Areas for the Electronics
Industry: Miniaturization and the
Environment |
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Steven J. Koester ( Manager of
Exploratory Technology group, IBM, USA)
[Link] |
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Topic: 3D Integration ¡V Technology,
Applications, and New Opportunities |
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IEEE COMPONENTS, PACKAGING,
& MANUFACTURING TECHNOLOGY SOCIETY
(IEEE CPMT-Taipei) |
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INDUSTRIAL TECHNOLOGY
RESEARCH INSTITUTE, TAIWAN (ITRI) |
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INTERNATIONAL MICROELECTRONICS
AND PACKAGING SOCIETY -TAIWAN (IMAPS-Taiwan) |
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I-SHOU UNIVERSITY (ISU) |
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SEMICONDUCTOR INDUSTRY
PROMOTION OFFICE (SIPO) |
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SURFACE MOUNT TECHNOLOGY
ASSOCIATION (SMTA) |
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TAIWAN PRINTED CIRCUIT
ASSOCIATION (TPCA) |
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| For questions
on paper submission, please contact: |
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Technical Program
Chair |
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Dr. Wei-Chung Lo
Àd³¥ò
Industrial Technology Research Institute
(ITRI)
E-mail:
service@impact.org.tw
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Secretariat |
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Mr. Long-Shien Lin
ªLÀs½å
Industrial Technology Research Institute
(ITRI)
E-Mail:
service@impact.org.tw |
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| Requests for
information about the Symposia should
be directed to: |
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Ms.Yaffy Liu
¼B²Q¬Â
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 381 5659 #402
Fax: +886 3 381 5150
E-Mail:
service@impact.org.tw |
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g
IMPACT & EMAP 2008 Album [more]
g
Bridge to the world [analysis] |
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2009/11/27
