October 20 ,2009

18:00
|
20:00

IMPACT International Welcome Dinner
Venue : Silks Palace at National Palace Museum

October 21, 2009

09:30
|
10:00

TPCA Show Opening

1F, Taipei Nangang Exhibition Hall

Room 504

10:00
|
10:20

　2009 IMPACT Opening

10:20

|

11:10

Keynote Address I

Ho-Ming, Tong (Chief R&D Officer, ASE, Taiwan)

IC Packaging as a Supply Chain Enabler & Future Trends

11:10

|

12:10

Keynote Address II

Delip Bokil (President, IMAPS, USA)

Microelectronics Packaging – Design to Manufacturing

Lunch

13:30
|
17:40

Room 501

Room 502

Room 503

Room 504a

Room 504 b

Room 401

Session 1
Design, Modeling & Testing I

Session 2 Advanced Packaging I

Session 3
HDI, Embedded and Advanced Technology

Session 4
SPIL Session

3D IC Workshop

X

18:00
|
20:30

TPCA Show & IMPACT Reception
Venue: 3F / CANTON Restaurant

October 22, 2009

9:00
|
9:50

Room 504

Keynote Address III
Robert C. Pfahl (VP, iNEMI Global Operations)

10:00 | 12:10

Room 501

Room 502

Room 503

Room 504a

Room 504 b

Room 401

Session 5
Reliability and Electro-migration

Session 6

3D Interconnection

Session 7
LED Thermal Solution

Session 8
Green PCB & PCBA I

Session 9
Nan Ya Plastics Session

 X

Lunch: 3F / CANTON Restaurant

13:30 | 17:40

Room 501

Room 502

Room 503

Room 504a

Room 504 b

Room 401

Session 10 Advanced Packaging II

Session 11

MEMS, Sensor and Microsystems Packaging

Session 12 Advanced Cooling Technology I

Session 13

Test, Quality, Inspection & Reliabililty Technology

Session 14

ASE Forum

Pb-Free Solders

X

14:30
|
16:30

October 23, 2009

9:00
|
9:50

Room 401

Keynote Address IV
Steven J. Koester (Manager of the Exploratory Technology Group at the IBM)
3D Integration – Technology, Applications, and New Opportunities　　　

10:00 | 12:10

Room 501

Room 502

Room 503

Room 504a

Room 504 b

Room 401

Session 15 Design, Modeling & Testing II

　Session 16 Green Materials and Process I

Session17
Novel Thermal Materials

Session 18
Green Materials & Assembly I

Session 19 Green PCB & PCBA II

International
3D IC Conference

12:10 | 13:30

      Award Ceremony

     Best Student Award & Outstanding Paper Award

 Lunch: 3F / Restaurant

13:30 | 17:40

Room 501

Room 502

Room 503

Room 504a

Room 504 b

Room 401

Session 20
Design, Modeling & Testing III

Session 21

Green Materials and Process II

Session 22
 Advnaced Cooling Technology II

Session 23
Green Materials & Assembly II

Session 24
PTH & Metal Finishing

International

3D IC Conference